The state of the art of lead-free solder joint reliability is investigated in this study. Emphasis is
placed on the design for reliability (DFR) and reliability testing and data analysis. For …

The ballasless track has been massively applied nowadays, while the interface damage
evolution of ballastless tracks is still rarely investigated. This work aims to investigate the …

Fatigue failure is a significant concern for magnesium (Mg) alloy components. However,
fatigue damage mechanisms of Mg alloys, particularly in the case of ratchetting–fatigue …

Based on crystal plastic theory, a novel thermomechanical constitutive model was proposed
for Sn‐rich solder. Material parameters of the proposed constitutive model were determined …

The goal of this project is to create an electronic module, or E-Module, for third grade
elementary school kids that is designed using the Book Creator application and integrated …

In this paper, long short-term memory (LSTM) networks are used in an original way to model
the behavior of a viscoplastic material solicited under changing loading conditions. The …

This article deals with the reliability of a power semiconductor exposing to the severe
thermal stresses. The importance of solder joint thickness on the power semiconductor's …

Reliability of lead-free solders, used in harsh conditions such as in automotive, is still a
serious concern. Simultaneous additions of multiple alloying elements like Bismuth (Bi) …

In this work, the combination of vibration loading and thermal cycle effects on the fatigue
properties of a solder joint in a Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) …

Under the action of a complex and harsh working environment, the damage of the IGBT
power module's packaging interconnection structure is the primary failure mode. The crack …