Optimization of stripline-based microfluidic chips for high-resolution NMR

J Bart, JWG Janssen, PJM Van Bentum… - Journal of magnetic …, 2009 - Elsevier
We here report on the optimization, fabrication and experimental characterization of a
stripline-based microfluidic NMR probe, realized in a silicon substrate. The stripline …

Improved RF devices for future adaptive wireless systems using two-sided contacting and AlN cooling

LK Nanver, H Schellevis, TLM Scholtes… - IEEE journal of solid …, 2009 - ieeexplore.ieee.org
This paper reviews special RF/microwave silicon device implementations in a process that
allows two-sided contacting of the devices: the back-wafer contacted Silicon-On-Glass …

High- Variable Pitch Spiral Inductors for Increased Inductance Density and Figure-of-Merit

S Tayenjam, V Vanukuru… - IEEE Transactions on …, 2019 - ieeexplore.ieee.org
Layout-optimized inductors with gradually varying width and spaced (tapered) spirals are
well known for their higher quality factor () characteristics. For the first time, the significance …

Porous Si as a substrate for the monolithic integration of RF and millimeter-wave passive devices (transmission lines, inductors, filters, and antennas): Current state-of …

P Sarafis, AG Nassiopoulou - Applied Physics Reviews, 2017 - pubs.aip.org
The increasing need for miniaturization, reliability, and cost efficiency in modern
telecommunications has boosted the idea of system-on-chip integration, incorporating the …

Aluminum nitride for heatspreading in RF IC's

L La Spina, E Iborra, H Schellevis, M Clement… - Solid-state …, 2008 - Elsevier
To reduce the electrothermal instabilities in silicon-on-glass high-frequency bipolar devices,
the integration of thin-film aluminum nitride as a heatspreader is studied. The AlN is …

High quality and low loss millimeter wave passives demonstrated to 77-GHz for SiP technologies using embedded wafer-level packaging platform (EMWLP)

YY Lim, X Xiao, SR Vempati, N Su… - IEEE Transactions …, 2010 - ieeexplore.ieee.org
With the increasing demand for system integration to cater to continuously increasing
number of I/Os as well as higher operating frequencies, reconfigured wafer-level packaging …

Simplified RF-MEMS switches using implanted conductors and thermal oxide

C Siegel, V Ziegler, B Schonlinner… - 2006 European …, 2006 - ieeexplore.ieee.org
This paper presents microwave capacitive RF-MEMS switches based on a novel simplified
fabrication process. The devices are fabricated on a silicon substrate using only one …

Design of -Band Wide-Beamwidth Circularly Polarized Wire-Bond Antenna

TY Lin, T Chiu, DC Chang - IEEE Transactions on Components …, 2017 - ieeexplore.ieee.org
A V-band wide-beamwidth left-handed circularly polarized wire-bond antenna is presented
in this paper. The proposed design, which is implemented by using integrated passive …

On-chip monolithic integrated antennas using CMOS ground supply planes

H Yordanov, V Poulkov, P Russer - IEEE Transactions on …, 2016 - ieeexplore.ieee.org
Monolithic integrated antennas have the potential to provide new functionality to wireless
systems on chip like higher integrability, fast and easy-to-implement chip-to-chip …

Analytical and numerical model of spiral inductors on high resistivity silicon substrates

K Mallik, A Abuelgasim, N Hashim, P Ashburn… - Solid-state …, 2014 - Elsevier
Passive devices and spiral inductors in particular suffer severely from losses in the silicon
substrate underneath. This major component in limiting the quality factor of spiral inductors …