[图书][B] Zastosowanie ceramiki LTCC w mikroelektronice

L Golonka - 2001 - dbc.wroc.pl
Wielowarstwowe moduły mikroelektroniczne typu LTCC (Low Temperature Cofired
Ceramic) są wytwarzane z surowej ceramiki (tzw. green tape). Folia LTCC grubości …

Fodel microresistors––processing and basic electrical properties

A Dziedzic, L Rebenklau, LJ Golonka… - Microelectronics …, 2003 - Elsevier
The dimensions of discrete passives, passive integrated components (arrays, networks) and
embedded integral ones should be significantly reduced in the nearest future. For example …

Application-specific economic analysis of integral passives in printed circuit boards

PA Sandborn, B Etienne… - IEEE Transactions on …, 2001 - ieeexplore.ieee.org
This paper presents an application-specific economic analysis of the conversion of discrete
passive components (resistors and capacitors) to integral passives that are embedded …

Nanolead-free solder pastes for low processing temperature interconnect applications in microelectronic packaging

H Jiang, K Moon, CP Wong - Nano-Bio-Electronic, Photonic and MEMS …, 2010 - Springer
Lead-free solder, tin, tin/silver (SnAg) and tin/silver/copper (SnAgCu) alloy nanoparticles
with various sizes were synthesized via a low temperature chemical reduction method and …

A material system for high precision embedded polymer resistor

JTY Su - 9th International Symposium on Advanced Packaging …, 2004 - ieeexplore.ieee.org
As we know, the dimension of embedded polymer resistor is directly related to the
resistance. Therefore the stability of dimension of polymer resistor during curing process. for …

[PDF][PDF] Temperature properties of Low Temperature Cofiring Ceramics (LTCC) and multilayer capacitors

A Dziedzic, LJ Golonka, M Henke - Proc. 43rd Int. Sci. Colloquium …, 1998 - researchgate.net
The use of passive components (resistors, capacitors, and inductors) is increased in modern
microelectronics. For example, the PC microprocessor speed increased over the last 15 …

Switchmode power supply miniaturization with emphasis on integrated passive components on prefired high performance ceramic substrates

RW Hoagland - 1999 - search.proquest.com
This Dissertation is a study of Switched Mode Power Supply (SMPS) miniaturization and
how to effectively use the available technologies to achieve the ultimate goal of a reduced …

[图书][B] Experimental qualification assessment and failure analysis for reworked and trimmed embedded resistor technologies

LJ Salzano II - 2003 - search.proquest.com
Discrete passive components are continuing to increase in use in electronic systems even
though manufacturers are increasing the degree to which these systems are integrating …

[PDF][PDF] APPLBCATION OF Tl-HCK FELIVIS IN LTCC TECHNOLOGY

LJ Golonka - midem-drustvo.si
Abstract; Typical thick film materials are widely used in Low Temperature Cofiring Ceramics
(LTCC) technology due to its low coiiring temperature This is a great advantage of LTCC in …

Introduction to Nanoparticle-Based Integrated Passives

R John, AP Malshe - Nano-Bio-Electronic, Photonic and MEMS Packaging, 2010 - Springer
This chapter discusses state of the art in nanoengineered integrated passives. In particular,
the chapter elaborates nanoparticle-based integrated passives that are being developed …