[HTML][HTML] Nanoindentation: introduction and applications of a non-destructive analysis

ZH Mahmoud, HNK AL-Salman, E Kianfar - Nano TransMed, 2024 - Elsevier
Nanoindentation test is known as a powerful method for non-destructive characterization
and analysis of mechanical properties of nanoscale materials. In this method, the indenting …

Synergistic fractural features observed in Ti-B-Si-C hard coatings on enhancing the sharpness of nano indenters

R Dash, K Bhattacharyya, AS Bhattacharyya - International Journal of …, 2023 - Elsevier
Abstract The multicomponent Ti-B-Si-C hard coatings consisting of different hard phases
have varied uses in tool, heavy duty as well as microelectronic industries, The fractural …

Stress distribution variations during nanoindentation failure of hard coatings on silicon substrates

R Dash, K Bhattacharyya… - … and Precision Engineering …, 2023 - pubs.aip.org
Regarding quality inspection of technologically important nanocomposite hard coatings
based on Ti, B, Si, C, and N and bioceramics such as hydroxyapatite that are used in small …

Sensitivity in nanomechanical pedestal MEMS cantilever

AK Rajak, R Dash, A Kumari… - Materials Today …, 2024 - Elsevier
Nanomechanical resonator-based sensing devices are used in medical diagnostics based
on their high-frequency dynamic behavior. Cantilevers fall into the category of …

[HTML][HTML] Mixed-Mode Fracture behaviour of Si-CN coatings

AS Bhattacharyya, K Bhattacharyya - Next Materials, 2024 - Elsevier
Micro-electro-mechanical systems (MEMS) technology has made it possible for the
semiconductor industry to construct systems and devices on silicon substrates …

[HTML][HTML] Growth of stable SiC2N2-Si2CN4 phases during nitrogen incorporated sputter deposition of silicon carbide

AS Bhattacharyya - Chemical Physics Impact, 2024 - Elsevier
The incorporation of nitrogen during sputtering of silicon carbide (Sisingle bondC) target
facilitates formation of different technologically significant phases. The bonding nature in …

Unexpected dual cracks in chip-ceramic substrate interconnect: Unveiling the mechanism behind simultaneous cracking at both the top and bottom of a solder joint

J Liu, T Chen, Q Nie, J Liu, P He, KW Paik… - Engineering Failure …, 2025 - Elsevier
Chip-ceramic interconnect is increasingly vital in high-density IC especially in high-
frequency applications, making the reliability of solder joints with underfill material in this …

[HTML][HTML] Effect of loading rate and coating thickness on wear and adhesion during sliding indents of Si–C–N/glass coatings useful for automotive applications

AS Bhattacharyya, K Bhattacharyya - Results in Surfaces and Interfaces, 2024 - Elsevier
Automotive components involving glass are coated with hard materials for protection
against, UV glaze, EM interference, abrasion, and thermal shock. Thermally resistant …

[HTML][HTML] Conducting Polymers in Biosensing: a review

AS Bhattacharyya - Chemical Physics Impact, 2024 - Elsevier
Medical diagnostics and, to a lesser extent, pharmacy is two of the most prominent
applications of organic conducting polymers (CPs). Polymers that conduct electricity, such …

Tin Multilayer‐Aided SAC305‐Based Lead‐Free Solder Joint Interface with Cu: An Investigation of the Stress Distribution by Finite Element Analysis and …

M Char, AK Chakraborty… - Advanced …, 2024 - Wiley Online Library
Two different types of lead‐free solder joints Cu/(Sn3. 0Ag0. 5Cu)/Cu and Cu/Sn/(Sn3.
0Ag0. 5Cu)/Sn/Cu have been investigated. Joints are produced following the transient liquid …