[HTML][HTML] High stability and aging resistance Sn-1Ag-0.5 Cu solder alloy by Fe and Bi minor alloying
The current work investigates the effect of Fe and Bi addition, 0.05 wt% Fe and 1 or 2 wt% Bi,
on the mechanical and microstructural properties of the Sn-1Ag-0.5 Cu (SAC105) solder …
on the mechanical and microstructural properties of the Sn-1Ag-0.5 Cu (SAC105) solder …
Soldering characteristics and mechanical properties of Sn-1.0 Ag-0.5 Cu solder with minor aluminum addition
YM Leong, A Haseeb - Materials, 2016 - mdpi.com
Driven by the trends towards miniaturization in lead free electronic products, researchers are
putting immense efforts to improve the properties and reliabilities of Sn based solders …
putting immense efforts to improve the properties and reliabilities of Sn based solders …