This review compares the mechanical and thermal-electrical properties of sintered copper
(Cu) with sintered silver (Ag) as bonding materials in the microelectronics joint applications …

There has been a significant rise in the number of research papers on silver nanoparticle
based solutions for harsh environment die attach. However, sintering nanoparticles is a …

Coupling the photoreduction of a metal precursor with 3D-printing technology is shown to
allow the fabrication of conductive 3D hybrid structures consisting of metal nanoparticles …

This work firstly evaluated the microscale mechanical properties of sintered Ag, consisting of
various Ag particles of a flake shape and spherical shape from nano to micro size …

Sinter joining with Ag particle paste has emerged as a promising lead-free die-attachment
solution for power devices owing to its low-temperature and pressureless processing …

Recent advances in nonlinear optics, hot electrons for renewable energy (eg, solar cells and
water‐splitting), acousto‐optics, nanometalworking, nanorobotics, steam generation, and …

Nanotechnology has become very popular in the sensor fields in recent times. It is thought
that the utilization of such technologies, as well as the use of nanosized materials, could well …

Sintered silver joint is a porous silver that bonds a semiconductor die to the substrate as part
of the packaging process. Sintered Ag is one of the few possible bonding methods to fulfill …

With the invention of chirped pulse amplification for lasers in the mid-1980s, high power
ultrafast lasers entered into the world as a disruptive tool, with potential impact on a broad …

Today, a growing number of third-generation semiconductor-based power devices are used
in products that can continuously operate at high temperatures for extended periods of time …