Proximity wireless communication technologies: An overview and design guidelines
This paper presents an overview of proximity wireless communication (PWC) technologies,
their principles, design guidelines and practical applications. In particular, two different …
their principles, design guidelines and practical applications. In particular, two different …
A 96-MB 3D-stacked SRAM using inductive coupling with 0.4-V transmitter, termination scheme and 12: 1 SerDes in 40-nm CMOS
A 28.8-GB/s 96-MB 3D-stacked SRAM is presented. A total of eight SRAM dies, designed in
a 40-nm CMOS process, are vertically stacked and connected using an inductive coupling …
a 40-nm CMOS process, are vertically stacked and connected using an inductive coupling …
Wixi: An inter-chip wireless bus interface for shape-changeable chiplet-based computers
J Kadomoto, H Irie, S Sakai - 2019 IEEE 37th International …, 2019 - ieeexplore.ieee.org
Herein, we propose a wireless bus interface that can connect multiple chips to form a flexible
system. In the proposed bus interface, on-chip coils are formed along the outer periphery of …
system. In the proposed bus interface, on-chip coils are formed along the outer periphery of …
A 3D-stacked SRAM using inductive coupling with low-voltage transmitter and 12: 1 SerDes
A 28.8-GB/s 96-MB 3D-stacked SRAM is presented. A total of eight SRAM dies, designed in
a 40-nm CMOS process, are vertically stacked and connected using an inductive coupling …
a 40-nm CMOS process, are vertically stacked and connected using an inductive coupling …
Inductors for chip to chip near field communication
E Chong, D Tonietto, Z Xiang - US Patent 10,483,343, 2019 - Google Patents
A device includes a first inductor positioned on a first substrate. The first inductor has at least
one turn in a plane that is perpendicular to a plane of the first substrate. The first inductor is …
one turn in a plane that is perpendicular to a plane of the first substrate. The first inductor is …
Inductively-Coupled High-Speed Interconnects of 3D-Integrated CMOS Image Sensors
T Ma, Z Xu, L Du, Y Du - 2022 7th International Conference on …, 2022 - ieeexplore.ieee.org
This paper presents a high-speed interconnect of 3D-integrated backside-illuminated (BSI)
CMOS image Sensor (CIS) chip by inductive coupling link. With the CIS fusion oxide …
CMOS image Sensor (CIS) chip by inductive coupling link. With the CIS fusion oxide …
[PDF][PDF] チップ間誘導結合通信を用いた形状自在計算機システム
門本淳一郎 - (No Title), 2021 - repository.dl.itc.u-tokyo.ac.jp
要旨計算機システムはその小型化や低消費電力化にともなって多様なデバイスへと組み込まれる
ようになり, 我々の生活空間に浸透している. 計算機システムの今後のアプリケーションとして注目 …
ようになり, 我々の生活空間に浸透している. 計算機システムの今後のアプリケーションとして注目 …