During the past decades, series of lead-free solders have been developed rapidly, and are
considered as the attractive interconnection materials replacing traditional Sn-Pb solders in …

Lead-free solder research has witnessed a great jump in the past decades due to the
increased restrictions over the use of toxic lead-bearing solder alloys. Among the …

Friction stir vibration brazing (FSVB) by application of mechanical vibration was introduced
in this investigation. In the current research, the adjoining samples are vibrated normally to …

This paper elucidated the effects of the Bi element (0 wt%, 0.5 wt% and 1.5 wt%) on the
microstructure, electrical, wettability and mechanical properties of the Sn-0.7 Cu-0.05 Ni as a …

With the development of microelectronic packaging and increasingly specific service
environment of solder joints, much stricter requirements have been placed on the properties …

Abstract The growth of Cu 6 Sn 5 and Cu 3 Sn 5 interfacial layers after isothermal annealing
and the resultant effect on the solder joint strength are studied in TiO 2 and Ni containing …

Abstract The effects of 0.05 wt% Ni additions on In-35 wt% Sn (In–35Sn) alloy on the ex-situ
interfacial reactions, in-situ microstructures formation during solidification, and mechanical …

The effect of TiO 2 addition on the microstructure, melting behavior, microhardness and
interfacial reaction between Sn-0.7 Cu-0.05 Ni and a Cu-substrate were explored. Samples …

The influence of the joint size on the growth of intermetallic compound (IMC) between Sn-3.0
Ag-0.5 Cu-0.1 TiO 2 composite solder and Cu pad during isothermal aging at temperatures …

Today's 3D electronic packaging is characterized by smaller size and higher functional
density, which generally require multiple reflow cycles. However, due to the Ostwald …