Determination of stress components in 4H-SiC power devices via Raman spectroscopy

R Sugie, T Uchida - Journal of Applied Physics, 2017 - pubs.aip.org
The stress dependencies of the phonon modes in a 4H silicon carbide (SiC) crystal were
investigated. The deformation potentials of the A 1 (TO), E 2, and E 1 (TO) modes were …

Effects of ion implantation process on defect distribution in SiC SJ-MOSFET

T Fukui, T Ishii, T Tawara, K Takenaka… - Japanese Journal of …, 2023 - iopscience.iop.org
A superjunction (SJ) structure in power devices is compatible with low specific on-resistance
and high breakdown voltage. To fabricate the SJ structure in SiC power devices, the …

Very High In‐Plane Magnetic Field Sensitivity in Ion‐Implanted 4H‐SiC PIN Diodes

H Okeil, T Erlbacher, G Wachutka - Advanced Electronic …, 2024 - Wiley Online Library
In this study ion‐implanted lateral 4H‐SiC pin diodes are reported, which show an
unexpectedly high room temperature in‐plane magnetic field sensitivity approaching 100 …

Thermoluminescence dosimetric properties of silicon carbide (SiC) used in industrial applications

H Toktamiş, PO Hama - Applied Radiation and Isotopes, 2019 - Elsevier
Abstract Silicon Carbide (SiC), also known as carborundum, has been found to be widely
useful as a substrate and wide band gap semiconductor in radiation resistant optoelectronic …

Lateral spreads of ion-implanted Al and P atoms in silicon carbide

Q Jin, M Nakajima, M Kaneko… - Japanese Journal of …, 2021 - iopscience.iop.org
Lateral spreads of Al and P atoms implanted (10∼ 700 keV) into a high-purity semi-
insulating 4H silicon carbide (SiC) substrate have been experimentally investigated …

Observation of point defect and carrier lifetime distributions in hydrogen or helium ion implanted SiC PiN diodes for suppression of bipolar degradation

M Kato, T Li, H Sakane, S Harada - Japanese Journal of Applied …, 2025 - iopscience.iop.org
We have reported that hydrogen or helium ion implantation can suppress the expansion of
stacking faults in SiC devices. These results suggest that point defects caused by ion …

Low-energy cross-sectional cathodoluminescence analysis of the depth distribution of point defects in Si-ion-implanted β-Ga2O3

R Sugie, T Uchida, A Hashimoto, S Akahori… - Applied Physics …, 2020 - iopscience.iop.org
Low-energy cross-sectional cathodoluminescence (CL) with a beam energy of 1 keV was
applied to Si-ion-implanted β-Ga 2 O 3 (− 201) wafers to investigate implantation damage …

3D structure of threading screw dislocation at a deep location in 4H-SiC using 3D micro-X-ray topography

K Ishiji, A Yoneyama, M Inaba, K Fukuda… - Japanese Journal of …, 2024 - iopscience.iop.org
We used 3D micro-X-ray topography (3D μ-XRT) to construct a 3D structure of the threading
screw dislocations (TSDs) in 4H-SiC. The 00012 diffraction condition, which can observe the …

Inert structural transition in 4H and 6H SiC at high pressure and temperature: A Raman spectroscopy study

S Maitani, R Sinmyo, T Ishii… - Journal of Physics …, 2024 - iopscience.iop.org
We conducted Raman spectroscopy measurements of 4H-SiC and 6H-SiC up to 69 GPa
and 1023 K to assess the stability and bonding of SiC at high pressure and temperature …

Depth Distribution of Defects in SiC PiN Diodes Formed Using Ion Implantation or Epitaxial Growth

S Fukaya, Y Yonezawa, T Kato… - physica status solidi (b …, 2022 - Wiley Online Library
In the development of 4H‐SiC bipolar devices, defect generation during the fabrication
process is an important issue for maintaining a long carrier lifetime in the drift layers. Herein …