In this study, a new tier partitioning algorithm for three‐dimensional integrated circuits (3D
ICs) using a genetic algorithm (GA) is presented. Design parameters for the proposed 3D IC …

ABSTRACT 3D integrated circuits (3D-ICs) is an emerging technology with lots of potential.
3D-ICs enjoy small footprint area and vertical interconnections between different dies which …

Three-dimensional (3D) design technology, which has potential to significantly improve
design performance and ease heterogeneous system integration, has been extensively …

3D IC offers significant benefits in terms of performance and cost. Existing research in
through-silicon via (TSV)-based 3D integration circuit (IC) partitioning has focused on …

During the billion transistor era, 3D stacking offers an attractive solution for the difficulties
resulting from large-scale design complexities. Moreover, 3D stacking can benefit …

We present an effective algorithm to partition a circuit into k layers under power density
constraints for 3D IC designs. Our algorithm utilizes a multilevel structure and a successive …

The rise of three-dimensional (3D) IC layouts necessitates the development of unique
partitioning methods that will be suitable for the 3D component designs. Net lists partitioning …

Due to the low thermal conductivities of dielectrics between active layers, there is a strong
demand to minimize the temperature rise of three-dimensional integrated circuits (3D ICs). In …

Under the current process and layer bonding technology for the TSV (through-silicon-via)
based 3D ICs, it is known that the TSV resource is one of the major sources of the function …

3D IC, a novel packaging technology, is heavily studied to realize improved performance
with denser packaging and reduced wirelength. Despite numerous advantages, thermal …