A wide-band microstrip-to-microstrip via transition proposed for connecting an integrated
circuit chip and an antenna array on the opposite sides of a multilayered low-temperature co …

A 3-D extension of the adaptive integral method (AIM) is presented for fast analysis of
scattering from electrically large perfect electrically conducting structures embedded inside a …

High-speed digital signal integrity at data rates above 6 Gb/s is an obstacle to reliable serial
link operation. Two signal integrity challenges include dispersion due to frequency …

This paper successfully extends the Foldy-Lax multiple scattering approach to model
massively-coupled multiple vias in substrate of layered dielectrics between two horizontal …

The solution of mixed electromagnetic/circuit problems is important for the electromagnetic
compatibility/signal integrity/power integrity system designs. The ever-increasing frequency …

A fast and accurate approach, based on the fast all-modes method (FAM) and the numerical
modified steepest descent path method (NMSP), was previously used to calculate the spatial …

A parallel iterative layered‐medium integral‐equation solver is presented for fast and
scalable network parameter extraction of electronic packages. The solver, which relies on a …

The broadband Green's function with low wavenumber extractions (BBGFL) consists of low
wavenumber method of moments (MoM) solutions combined with modal expansions …

Based on equivalent magnetic frill array model and Galerkin's procedure, we present a
simplified full-wave algorithm to characterize the propagation behavior and signal integrity of …

3-D interconnect techniques in multilayer very large scale integration design, such as
stacked layers and various chip-stacking systems, have paved the way for the improvement …