Stability, reliability, and robustness of GaN power devices: A review

JP Kozak, R Zhang, M Porter, Q Song… - … on Power Electronics, 2023 - ieeexplore.ieee.org
Gallium nitride (GaN) devices are revolutionarily advancing the efficiency, frequency, and
form factor of power electronics. However, the material composition, architecture, and …

[HTML][HTML] Technology and reliability of normally-off GaN HEMTs with p-type gate

M Meneghini, O Hilt, J Wuerfl, G Meneghesso - Energies, 2017 - mdpi.com
GaN-based transistors with p-GaN gate are commonly accepted as promising devices for
application in power converters, thanks to the positive and stable threshold voltage, the low …

Reliability and parasitic issues in GaN-based power HEMTs: A review

G Meneghesso, M Meneghini, I Rossetto… - Semiconductor …, 2016 - iopscience.iop.org
Despite the potential of GaN-based power transistors, these devices still suffer from certain
parasitic and reliability issues that limit their static and dynamic performance and the …

Time-dependent failure of GaN-on-Si power HEMTs with p-GaN gate

I Rossetto, M Meneghini, O Hilt… - … on Electron Devices, 2016 - ieeexplore.ieee.org
This paper reports an experimental demonstration of the time-dependent failure of GaN-on-
Si power high-electron-mobility transistors with p-GaN gate, submitted to a forward gate …

Evidence of hot-electron effects during hard switching of AlGaN/GaN HEMTs

I Rossetto, M Meneghini, A Tajalli… - IEEE transactions on …, 2017 - ieeexplore.ieee.org
This paper reports on the impact of soft-and hard-switching conditions on the dynamic ON-
resistance of AlGaN/GaN high-electron mobility transistors. For this study, we used a special …

[HTML][HTML] Atomic layer deposition of silicon nitride thin films: a review of recent progress, challenges, and outlooks

X Meng, YC Byun, HS Kim, JS Lee, AT Lucero… - Materials, 2016 - mdpi.com
With the continued miniaturization of devices in the semiconductor industry, atomic layer
deposition (ALD) of silicon nitride thin films (SiNx) has attracted great interest due to the …

Forward bias gate breakdown mechanism in enhancement-mode p-GaN gate AlGaN/GaN high-electron mobility transistors

TL Wu, D Marcon, S You, N Posthuma… - IEEE Electron device …, 2015 - ieeexplore.ieee.org
In this letter, we studied the forward bias gate breakdown mechanism on enhancement-
mode p-GaN gate AlGaN/GaN high-electron mobility transistors. To the best of our …

Reliability and failure analysis in power GaN-HEMTs: An overview

M Meneghini, I Rossetto, C De Santi… - 2017 IEEE …, 2017 - ieeexplore.ieee.org
Power GaN transistors have recently demonstrated to be excellent devices for application in
power electronics. The high breakdown field and the superior mobility of the 2-dimensional …

Investigation of In Situ SiN as Gate Dielectric and Surface Passivation for GaN MISHEMTs

H Jiang, C Liu, Y Chen, X Lu… - IEEE Transactions on …, 2017 - ieeexplore.ieee.org
In this paper, we present a systematic investigation of metal–organic chemical vapor
deposition-grown in situ SiN as the gate dielectric and surface passivation for AlGaN/GaN …

Studies on High-Voltage GaN-on-Si MIS-HEMTs Using LPCVD Si3N4 as Gate Dielectric and Passivation Layer

Z Zhang, G Yu, X Zhang, X Deng, S Li… - … on Electron Devices, 2016 - ieeexplore.ieee.org
This paper investigates the performance of AlGaN/gallium nitride (GaN) MIS high electron
mobility transistors (MIS-HEMTs). The gate dielectric layer and the surface passivation layer …