Applying modern data mining in electronic design automation and test has become an area
of growing interest in recent years. This paper reviews some of the recent developments in …

Wafer-level performance prediction has been attracting attention to reduce measurement
costs without compromising test quality in production tests. Although several efficient …

We introduce a methodology for dynamically selecting whether to subject a wafer to a
complete or a reduced probe-test flow, while ensuring that the concomitant test cost savings …

Statistical wafer-level variation modeling is an attractive method for reducing the
measurement cost in large-scale integrated circuit (LSI) testing while maintaining the test …

Although automotive semiconductors must comply with the standard dynamic part average
testing (DPAT) defined by the Automotive Electronics Council, it remains challenging to …

We investigate the utility of correlations between e-test and probe test measurements in
predicting yield. Specifically, we first examine whether statistical methods can accurately …

Wafer-level performance prediction techniques have been increasingly gaining attention in
production LSI testing due to their ability to reduce measurement costs without …

Electrical testing of semiconductor devices is a critical process for ensuring their quality and
reliability. Despite the existence of the standard dynamic part average test (DPAT), the …

Semiconductor fabrication is one of the most intricate, multistep, human-made processes,
taking place every day, producing trillions of transistors every second. The complexity of this …

In this paper, we propose a novel method for predicting the characteristic failure rate from a
small amount of data with high accuracy using the posterior distribution of the Gaussian …