JM Cesaretti - US Patent 10,107,873, 2018 - Google Patents
The present disclosure is directed to an electronic circuit having a Hall effect element and a resistor bridge, all disposed over a common semiconductor substrate. The resistor bridge …
JM Cesaretti - US Patent 10,162,017, 2018 - Google Patents
The systems and methods described can reduce high order temperature coefficients on the Hall plate sensitivity. A temperature coefficient circuit may include a first amplifier to receive …
JM Cesaretti, AP Friedrich, GA Monreal… - US Patent …, 2019 - Google Patents
US10520559B2 - Arrangements for Hall effect elements and vertical epi resistors upon a substrate - Google Patents US10520559B2 - Arrangements for Hall effect elements and vertical …
M Eckinger, S Kolb - US Patent 9,741,925, 2017 - Google Patents
Methods for doping an active Hall effect region of a Hall effect device in a semiconductor substrate, and Hall effect devices having a doped active Hall effect region are provided. A …
JM Cesaretti - US Patent 10,254,354, 2019 - Google Patents
The present disclosure is directed to an electronic circuit having a Hall effect element and a resistor bridge, all disposed over a common semiconductor substrate. The resistor bridge …
S Kosier, N Hoilien - US Patent 9,735,345, 2017 - Google Patents
In one aspect, a vertical Hall effect sensor includes a semiconductor wafer having a first conductivity type and a plurality of semiconductive electrodes disposed on the …
JM Cesaretti - US Patent 10,746,818, 2020 - Google Patents
The systems and methods described can reduce high order temperature coefficients on the Hall plate sensitivity. A temperature coefficient circuit may include a first amplifier to receive …
B Cadugan, H Wong, WP Taylor - US Patent 11,296,247, 2022 - Google Patents
US11296247B2 - Photodetector with a buried layer - Google Patents US11296247B2 - Photodetector with a buried layer - Google Patents Photodetector with a buried layer Download …
T Hioka, M Ebihara - US Patent 9,741,924, 2017 - Google Patents
A magnetic sensor has a pair of Hall elements formed in spaced-apart relationship on a front surface of a semiconductor substrate. A die pad is bonded to a back surface of the …