[HTML][HTML] Fluid flow and heat transfer in microchannel heat sinks: Modelling review and recent progress

J Gao, Z Hu, Q Yang, X Liang, H Wu - Thermal Science and Engineering …, 2022 - Elsevier
Nowadays, microchannels have been widely utilized in various multidisciplinary fields, and
as a consequence, some new and different requirements for microchannels in the process of …

Co-designing electronics with microfluidics for more sustainable cooling

R Van Erp, R Soleimanzadeh, L Nela, G Kampitsis… - Nature, 2020 - nature.com
Thermal management is one of the main challenges for the future of electronics,,,–. With the
ever-increasing rate of data generation and communication, as well as the constant push to …

Numerical investigation on manifold immersion cooling scheme for lithium ion battery thermal management application

Q Le, Q Shi, Q Liu, X Yao, X Ju, C Xu - … Journal of Heat and Mass Transfer, 2022 - Elsevier
Thermal management is very important because lithium-ion batteries generate a lot of heat
under high rate charging and discharging. Inspired by the manifold microchannel (MMC) …

Multi-objective optimization of manifold microchannel heat sink with corrugated bottom impacted by nanofluid jet

J Cheng, H Xu, Z Tang, P Zhou - International Journal of Heat and Mass …, 2023 - Elsevier
The manifold microchannel heat sink (MMCHS) has been widely used for heat dissipation of
high heat-flux electronic devices. To reduce the thermal resistance and flow resistance of …

[HTML][HTML] Numerical investigation on the temperature uniformity of micro-pin-fin heat sinks with variable density arrangement

HC Chiu, MJ Youh, RH Hsieh, JH Jang… - Case Studies in Thermal …, 2023 - Elsevier
Temperature non-uniformity on chips has drawn the attention of researchers due to
unwanted thermal stress development on chips resulting in a reduction in their life cycle and …

A comparative numerical study on two-phase boiling fluid flow and heat transfer in the microchannel heat sink with different manifold arrangements

Y Luo, J Zhang, W Li - International Journal of Heat and Mass Transfer, 2020 - Elsevier
The manifold microchannel (MMC) heat sink system has been widely used in high-heat-flux
chip thermal management due to its high surface-to-volume ratio. Two-phase, three …

The ICECool fundamentals effort on evaporative cooling of microelectronics

A Bar-Cohen, M Asheghi, TJ Chainer… - IEEE Transactions …, 2021 - ieeexplore.ieee.org
The Intrachip Enhanced Cooling Fundamentals (ICECool Fun) effort was launched by the
Defense Advanced Research Projects Agency (DARPA) under the leadership of Dr. Avram …

Multi-objective optimization of efficient liquid cooling-based battery thermal management system using hybrid manifold channels

Z Sui, H Lin, Q Sun, K Dong, W Wu - Applied Energy, 2024 - Elsevier
Maintaining a battery cell at an optimal temperature improves both its performance and
lifespan. This study proposes a cold plate equipped with hybrid manifold channels …

A numerical study of subcooled flow boiling in a manifold microchannel heat sink with varying inlet-to-outlet width ratio

Y Luo, J Li, K Zhou, J Zhang, W Li - International Journal of Heat and Mass …, 2019 - Elsevier
The manifold microchannel heat sink receives an increasing number of attention lately due
to its high heat flux dissipation. Numerical investigation of boiling phenomena in manifold …

Parametric design analysis of a multi-level 3D manifolded microchannel cooler via reduced order numerical modeling

S Hazra, T Wei, Y Lin, M Asheghi, K Goodson… - International Journal of …, 2022 - Elsevier
Waste heat flux from power dense electronics is expected to reach> 1 kW/cm 2 in the next
few decades, and they will require novel cooler designs with low thermal resistance, that can …