Z Wu, B Sunden - Renewable and Sustainable Energy Reviews, 2014 - Elsevier
With fast growing power consumption and device miniaturization, micro/minichannels are superior to macrochannels or conventional channels for high heat-flux dissipation due to …
Y Li, H Wu - International Journal of Heat and Mass Transfer, 2022 - Elsevier
Improving the critical heat flux (CHF) and avoiding dry out downstream are the keys to enhance the two-phase cooling performance of microchannel heat sinks. In this work, a …
K Fu, W Gao, X Xu, X Liang - Applied Thermal Engineering, 2023 - Elsevier
Flow boiling of water in a copper foam fin microchannel (FFMC) heat sink is investigated experimentally. The heat sink has nine channels, which are 487 μm in width and 1061 μm in …
Flow boiling with deionized water in silicon (Si) microchannels was drastically enhanced in a single annular flow boiling regime enabled by superhydrophilic Si nanowire inner walls …
N Tiwari, MK Moharana - International Journal of Heat and Mass Transfer, 2021 - Elsevier
Three-dimensional numerical study on two-phase flow boiling in rectangular microchannel with wavy vertical wall configuration is considered that can be utilized for heat dissipation in …
Flow boiling instabilities inherent in microchannels/microgaps remain to be a serious issue in two-phase high-heat-flux cooling applications, as they cause significant oscillations in …
W Li, C Li, Z Wang, Y Chen - International Journal of Heat and Mass …, 2022 - Elsevier
In conventional microchannels, the flow boiling performances are strongly affected by the highly transitional two-phase flow regimes. In this study, a novel capillary structure made …
Flow boiling of dielectric fluids in microchannels is one of the most desirable cooling solutions for high power electronics. However, the flow boiling of dielectric fluids is hindered …
N Mao, J Zhuang, T He, M Song - Heat and Mass Transfer, 2021 - Springer
Due to the development of the electronic components, concentrator photovoltaic, fuel cell, etc., the cooling requirement of the devices increases rapidly. Due to the higher heat transfer …