The ever increasing requirements for electrical performance of on-chip wiring has driven
three major technological advances in recent years. First, copper has replaced Aluminum as …

The columnar structure found in thin evaporated films deposited at low temperatures has
been accurately reproduced using computer simulations of sequentially deposited hard disc …

We present a thorough study of the microstructure, texture, intrinsic stress, surface, and
interface morphology of transition metal nitride (mainly TiN but also CrN) films grown on Si …

A two-step Monte Carlo method for atomistically simulating low energy physical vapor
deposition processes is developed and used to model the two-dimensional physical vapor …

We have developed a three-dimensional Monte Carlo simulator for thin film growth and
applied it to understand the morphologies of thin films prepared by dynamic oblique …

The kinetic energy of an adatom during its impact with a growth surface significantly affects
the morphology and microstructure of vapor-deposited films and coatings. Atomic-scale …

We present a two-dimensional polycrystalline thin film growth model based on describing
grains in terms of faceted surfaces and grain boundaries. The profiles of the nuclei are …

Low-pressure sputtering and ionized vapor deposition processes create atomic fluxes with
kinetic energies in the 1.0–20eV (and above) range. The impact energy of these …

Deposition rate, electrical resistivity, microstructure, surface roughness, and preferred
orientation of aluminum films from metal-organic chemical vapor deposition (MOCVD) with …

This study modeled deposition processes using statistical ensemble and feature-scale voxel
methods to predict the coverage and film properties on a large-scale pattern for the first time …