HJ Lee, S Yao - Heat Transfer Summer Conference, 2009 - asmedigitalcollection.asme.org
During the operation of parallel evaporative micro-channels, system instability may occur in terms of cyclical fluctuations at a long period. This is due to the co-existence of the liquid …
Q Han, J Wang, Q Li - 2010 - asmedigitalcollection.asme.org
The frequency response characteristic of a general time-invariant system has been extensively analyzed in literature. However, it has not gained sufficient attentions in the …
A Polar, JE Indacochea, ML Wang - 2010 - asmedigitalcollection.asme.org
The creep evolution was followed by conducting magnetic measurements on ferromagnetic steel samples exposed to different creep strains at a constant temperature. 410 stainless …
S Salakij, JA Liburdy, DV Pence - Heat Transfer …, 2012 - asmedigitalcollection.asme.org
The present work shows the potential of using a diverging channel with in-situ vapor extraction as a means to reduce flow instability in microscale flow boiling. It has been shown …
S Salakij, DV Pence, JA Liburdy - ASME …, 2013 - asmedigitalcollection.asme.org
A major detriment of two-phase microscale flow systems is a relatively high pressure drop, as well as the potential for flow instabilities. A possible mechanism to overcome these …
S Salakij, JA Liburdy, DV Pence - ASME …, 2010 - asmedigitalcollection.asme.org
The use of two phase cooling strategies for high power microelectronics has been being widely investigated in order to better control desired operating temperatures and to reduce …
In-situ vapor extraction is performed by applying a pressure differential across a hydrophobic porous membrane that forms a wall of the channel as a means of reducing the …
HJ Lee, SC Yao - Heat transfer engineering, 2012 - Taylor & Francis
A network analysis was established to model the array of evaporative microchannels with possible nonuniformity heating as well as branching of the channels. Iterative solution of the …
For many years evaporative micro-channel systems have been considered for the cooling of high power electronics due to large surface area per unit volume and efficient heat transfer …