Epoxy resins are widely used in many fields because of their excellent physical and
chemical properties. Unfortunately, epoxy resins are inherently combustible materials and …

Bio‐based epoxy resins with low‐dielectric constant, low viscosity and excellent mechanical
properties have great significance for the future of advanced electronic and microelectronic …

Epoxy resins are well-known adhesive materials, however, the high dielectric constant (D k)
limited their application in microelectronic devices. Additionally, non-degradability is a …

Bisphenol analogs (BPs) are widely used in industrial and commercial products and have
been detected in surface water, sediment, sewage, and sludge. The presence of BPs in the …

Microwave irradiation is one of the most effective strategies to accelerate the curing of resin.
However, the mechanism is still unclear. The debates mainly focus on how to quantitatively …

A series of latent curing agents were developed by replacing the hydrogen atom on
secondary amine in imidazole with methoxy polyethylene glycol maleate diesters via …

Diglycidyl ether of bisphenol A (DGEBA) epoxy resin is cured by two typical diethylene
triamine-derived curing agents which have a versamid structure (VDETA) and a butyl ether …

To address the growing need for fire-safe single-component epoxy resin (EP) systems, this
study introduced a phosphorus-containing copper complex (Cu-DA) as a multifunctional …

Catalyst-free synthesis in three kinds of isocyanate-blocked imidazole compound was
successfully achieved by chemically connecting 2-ethyl-4-methylimidazole (2E4MI) with …

In high-performance polymer matrix composite assemblies, adhesive bonding is generally
superior to mechanical fastening in structural performance and manufacturing efficiency …