It is well known that the elastoplastic properties of materials are important indicators to
characterize their mechanical behaviors and are of guiding significance in the field of …

A mesoscopic constitutive model coupled with crystal plasticity (CP) and damage is
established in this paper to investigate the plastic deformation and damage-induced …

As one of the promising packaging materials, the paste of silver nanoparticles (AgNPs)
reinforced by SiC particles is investigated in this study for microstructure, thermal stability …

The recovery of gold (Au) from waste printed circuit boards (WPCBs) derived from discarded
mobile phones is crucial for the resource preservation and environmental protection. In this …

Nanoindentation technology is an effective and convenient method for evaluating the
mechanical properties of materials at micro and nano scales. Since the complete …

To meet the increasing requirement of high-temperature die attach for power module on the
excellent thermal conductivity and reliability, a novel Ag paste modified with AlN …

This paper deals with the effects of electric current on the thermomechanical lifetime of
solder joint as the most vulnerable part in electronic packages. The main focus of this paper …

The evolution of the plastic zone underneath the indenter is challenging to be described
during nanoindentation, which is recently known to be crucial to establish a constitutive …

The process of transient liquid phase bonding to form intermetallic compound solder joints
can effectively achieve 3D chip stack interconnection. However, there are a large number of …

Aiming for a suitable die-attached substrate for Ag-sintered joint technology during harsh
operating environment, three surface finishes of sputtered Ti/Ag-layers, electroless Ni-/Pt-/Ag …