Overview of transient liquid phase and partial transient liquid phase bonding

GO Cook III, CD Sorensen - Journal of materials science, 2011 - Springer
Transient liquid phase (TLP) bonding is a relatively new bonding process that joins
materials using an interlayer. On heating, the interlayer melts and the interlayer element (or …

Solidification and solid state phenomena during TLP bonding of IN718 superalloy using Ni–Si–B ternary filler alloy

M Pouranvari, A Ekrami, AH Kokabi - Journal of alloys and compounds, 2013 - Elsevier
This paper addresses solidification and solid state precipitation phenomena during transient
liquid phase (TLP) bonding of wrought IN718 nickel base superalloy using Ni–4.5 Si–3.2 B …

Transient liquid phase bonding of IN738LC/MBF-15/IN738LC: solidification behavior and mechanical properties

B Binesh, AJ Gharehbagh - Journal of Materials Science & Technology, 2016 - Elsevier
Transient liquid phase (TLP) bonding of IN738LC superalloy was carried out using a rapidly
solidified MBF-15 Ni-based foil. The effects of bonding temperature (1130–1170° C) and …

Microstructure evolution mechanism during post-bond heat treatment of transient liquid phase bonded wrought IN718 superalloy: an approach to fabricate boride-free …

M Pouranvari, A Ekrami, AH Kokabi - Journal of Alloys and Compounds, 2017 - Elsevier
The microstructure of a transient liquid phase (TLP) bonded nickel base superalloy using B-
containing filler metal after completion of isothermal solidification can usually be described …

TLP bonding of cast IN718 nickel based superalloy: process–microstructure–strength characteristics

M Pouranvari, A Ekrami, AH Kokabi - Materials Science and Engineering: A, 2013 - Elsevier
This paper aims at addressing the microstructure–strength characteristics relationship
during transient liquid phase (TLP) bonding of cast IN718 nickel based superalloy using Ni …

[HTML][HTML] Effect of bonding temperature and bonding time on microstructure of dissimilar transient liquid phase bonding of GTD111/BNi-2/IN718 system

AI Ghahferokhi, M Kasiri-Asgarani… - Journal of Materials …, 2022 - Elsevier
The effect of bonding temperature and bonding time on the microstructure of transient liquid
phase (TLP) bonding named GTD111 and IN718 superalloys, using a commercial Ni–B–Cr …

Transient liquid phase bonding of IC10 single crystal with GH3039 superalloy using BNi2 interlayer: Microstructure and mechanical properties

LX Zhang, Z Sun, Q Xue, M Lei, XY Tian - Materials & Design, 2016 - Elsevier
Transient liquid bonding (TLP) of IC10 single crystal with GH3039 alloy was carried out
using BNi2 interlayer. Microstructure evolution and mechanical properties of the joints …

Effect of bonding time on the microstructure and isothermal solidification completion during transient liquid phase bonding of dissimilar nickel-based superalloys …

M Khakian, S Nategh, S Mirdamadi - Journal of Alloys and Compounds, 2015 - Elsevier
Joining of dissimilar nickel base superalloys IN738LC to Nimonic 75 by use of transient
liquid phase bonding with Ni–15Cr-3.5 B interlayer (MBF-80) was carried out at …

Microstructure and mechanical properties in the solid-state diffusion bonding joints of Ni3Al based superalloy

L Yuan, J Xiong, Y Peng, J Shi, J Li - Materials Science and Engineering: A, 2020 - Elsevier
Directional solidification (DS) of intermetallic compounds Ni 3 Al based superalloys were
joined by solid-state diffusion bonding (SSDB) with the joining interface perpendicular to the …

Transient liquid phase bonding of wrought IN718 nickel based superalloy using standard heat treatment cycles: Microstructure and mechanical properties

M Pouranvari, A Ekrami, AH Kokabi - Materials & Design, 2013 - Elsevier
Transient liquid phase (TLP) diffusion bonding is a preferred joining/repairing technique for
nickel based superalloy. In this research, TLP bonding process carried out according to the …