The metallic interconnects are essential components of energy devices such as fuel cells
and electrolysis cells, batteries, as well as electronics and optoelectronic devices. In recent …

Three-dimensional chiral metallic metamaterials have already attracted extensive attention
in the wide research fields of chiroptical responses. These artificial chiral …

Microscale dynamic testing is vital to the understanding of material behavior at application
relevant strain rates. However, despite two decades of intense micromechanics research …

Conventional additive manufacturing (AM) technology driven by thermal energy have
enabled reliable fabrication of macro/micro metal structures. Thermally printed metal …

As a kind of environmentally friendly and highly effective additive, alcohols have broad
application prospects in copper electrodeposition. It is highly desired to expand the types of …

In order to avoid damage to the substrate surface and environment pollution by the
traditional electroless plating (ECP) pretreatment process, we have designed and fabricated …

In order to realize the convenient process of metalization on different materials and make
electroless plating more efficient and fast, a multi-dentate ligand Ag complex (MLAg) was …

Electroplated copper is a key electronic interconnect material in integrated circuits and
printed circuits and inevitably exposed to corrosive media in manufacturing processes. The …

Five-generation communication, foldable cell phone, and wearable devices promote the
development of Cu foils by applying multi-layer printed circuit board (MLPCB) and flexible …

Electroless plating is a promising method to achieve material surface metallization, low
rupture work of plated coating and complex production processes have become important …