Lead-free solder research has witnessed a great jump in the past decades due to the
increased restrictions over the use of toxic lead-bearing solder alloys. Among the …

Nanocomposite lead-free solders are gaining prominence as replacements for conventional
lead-free solders such as Sn–Ag–Cu solder in the electronic packaging industry. They are …

Lightweighting in the transportation industry is today recognized as one of the most
important strategies to improve fuel efficiency and reduce anthropogenic climate-changing …

Composites of SC solder reinforced with 0, 0.25, 0.5 and 1wt.% of TiO2 nanoparticles were
fabricated using a mechanical technique. With increased addition of TiO2 nanoparticles, the …

Effects of Co nanoparticle additions to Sn–3.8 Ag–0.7 Cu on the structure of solder/copper
interface have been studied after reflow and high temperature ageing (150° C, up to 1008 …

In this study, the effect of La 2 O 3 nanoparticles (0, 0.01, 0.03, 0.05 and 0.1 wt.%) has been
investigated in Sn–3.0 Ag–0.5 Cu (SAC-305) alloy. The various soldering properties have …

The effect of graphene nanoplatelets (GNPs) on the wettability, microstructure, and tensile
properties of Sn-3.0 Ag-0.5 Cu (SAC 305) was studied using melting and casting route. The …

In the electronics industry, graphene is applied with modified lead-free solder. This review
presents advances in the preparation, strengthening mechanisms, and property …

The effect of TiO 2 addition on the microstructure, melting behavior, microhardness and
interfacial reaction between Sn-0.7 Cu-0.05 Ni and a Cu-substrate were explored. Samples …

Abstract Sn-0.7 Cu is among the least expensive types of lead-free solders available.
However, its poor mechanical properties have limited its application. In this study, Sn-Cu …