The role of power device technology in the electric vehicle powertrain
In the automotive industry, the design and implementation of power converters and
especially inverters, are at a turning point. Silicon (Si) IGBTs are at present the most widely …
especially inverters, are at a turning point. Silicon (Si) IGBTs are at present the most widely …
An Overview of Mechanical Characterization for Power Module: Challenges, Advances and Future Prospects
Driven by advancements in the semiconductor technology, especially silicon carbide,
numerous packaging designs have been developed to meet demands of various …
numerous packaging designs have been developed to meet demands of various …
[HTML][HTML] Quasi-direct Cu–Si3N4 bonding using multi-layered active metal deposition for power-module substrate
The advancement of power modules demands more reliable insulating circuit substrates.
Traditional substrates, comprising Cu and Si 3 N 4, are produced using active metal brazing …
Traditional substrates, comprising Cu and Si 3 N 4, are produced using active metal brazing …
Finite Element Simulation and Sensitivity Analysis of the Cohesive Parameters for Delamination Modeling in Power Electronics Packages
Delamination is a critical failure mode in power electronics packages that can significantly
impact their reliability and performance, due to the large amounts of electrical power …
impact their reliability and performance, due to the large amounts of electrical power …
Thermal measurement and numerical analysis for automotive power modules
A Sitta, M Renna, AA Messina… - … and Multi-Physics …, 2020 - ieeexplore.ieee.org
The presented analysis has been aimed to evaluate the impact of die solder and sintering
solution for automotive power modules in terms of thermal behavior. First, dedicated …
solution for automotive power modules in terms of thermal behavior. First, dedicated …
A stress-relieved method based on bottom pattern design considering thermal and mechanical behavior of DBC substrate
Currently, stress analysis on direct bonded copper (DBC) is mainly based on a model with
symmetrical top and bottom copper layers. These analyses provide thermal-mechanical …
symmetrical top and bottom copper layers. These analyses provide thermal-mechanical …
Evaluation of in situ Thermomechanical Stress–Strain in Power Modules Using Laser Displacement Sensors
AB Jørgensen, S Munk-Nielsen… - IEEE Transactions on …, 2021 - ieeexplore.ieee.org
Digital design has been successfully employed in development of new compact wide
bandgap power modules, achieving unprecedented switching speeds while maintaining low …
bandgap power modules, achieving unprecedented switching speeds while maintaining low …
Package Design and Analysis of a 20-kV Double-Sided Silicon Carbide Diode Module With Polymer Nanocomposite Field-Grading Coating
To tackle the insulation challenges present in packaging medium-voltage (MV) silicon
carbide (SiC) power devices, we developed a package design for a 20-kV SiC. This design …
carbide (SiC) power devices, we developed a package design for a 20-kV SiC. This design …
Development of SiC power module structure by micron-sized Ag-paste sinter joining on both die and heatsink to low-thermal-resistance and superior power cycling …
C Chen, A Suetake, F Huo, D Kim… - … on Power Electronics, 2024 - ieeexplore.ieee.org
In this study, the thermal characteristics and structure reliability during power cycling for the
four types of SiC power module fabricated using a SiC-heater chip, direct bonded aluminum …
four types of SiC power module fabricated using a SiC-heater chip, direct bonded aluminum …
Warpage modeling and characterization of intelligent power modules (IPMs)
MK Shih, TK Lee, JG Chang - Journal of Mechanics, 2021 - academic.oup.com
Intelligent power modules (IPMs) are widely used in the electric vehicle (and hybrid electric
vehicle industry nowadays due to their high power density and ability to integrate multiple …
vehicle industry nowadays due to their high power density and ability to integrate multiple …