Mechanism of wire bond shear testing
Shear testing of wire bonds in microelectronics devices is important in bonding process
qualification, but the actual mechanism of shearing Cu bonds from Al pads is not thoroughly …
qualification, but the actual mechanism of shearing Cu bonds from Al pads is not thoroughly …
Life prediction of copper wire bonds in commercial devices using principal component analysis (PCA)
Copper has been widely adopted as a viable alternative to gold for wire bonding, due to its
lower cost, better electrical and thermal conductivity, lower tendency for wire sweep due to a …
lower cost, better electrical and thermal conductivity, lower tendency for wire sweep due to a …
Review of shelf life evaluation methods and a physics of failure approach for shelf life estimation for electronic components
NMJ Li, D Das, P McCluskey - Microelectronics Reliability, 2019 - Elsevier
Long term storage reliability or shelf life is not well understood in the electronic industry. In
this article, we identified inconsistent shelf life interpretations used in the electronics industry …
this article, we identified inconsistent shelf life interpretations used in the electronics industry …
Mechanics of copper wire bond failure due to thermal fatigue
S Manoharan, NMJ Li, C Patel, S Hunter… - 2018 IEEE 20th …, 2018 - ieeexplore.ieee.org
Thermal stresses occur on wire Bonds due to mismatch of coefficient of thermal expansion
(CTE) between wire and mold compound in addition to the global deformation of the …
(CTE) between wire and mold compound in addition to the global deformation of the …
Deriving lifetime predictions for wire bonds at high temperatures
MD Hook, S Hunter, M Mayer - Microelectronics Reliability, 2018 - Elsevier
We report a method to predict wire bond lifetimes. Wire bond resistance increase due to
thermal stress can be modelled by the Arrhenius equation, permitting prediction of wire bond …
thermal stress can be modelled by the Arrhenius equation, permitting prediction of wire bond …