In this study, the microstructure evolution in the powder-bed electron beam additive
manufacturing (EBAM) process is studied using phase-field modeling. In essence, EBAM …

Sn–Bi solders may be applied for electronic applications where low-temperature soldering is
required, ie, sensitive components, step soldering and soldering LEDs. In spite of their …

Alloys from the Snsingle bondCu systems have superior properties as compared to the
Snsingle bondPb alloys, such as mechanical and corrosion resistance. However, Snsingle …

The microstructure and mechanical properties of five binary pre-aged Sn-Cu alloys with
varying Cu contents were investigated. The Cu compositions examined varied from 1 wt% to …

Abstract The Al-11 wt% Si-5 wt% Ni eutectic alloy was directionally solidified (DS) under
transient heat flow conditions at cooling rates in a range of about 1–25° C/s along the length …

Low temperature soldering technology encompasses Sn–Bi based alloys as reference
materials for joints since such alloys may be molten at temperatures less than 180° C …

Samples extracted along the length of directionally solidified (DS) castings of three Sn-x Bi
alloys (x= 34 wt.% Bi, 52 wt.% Bi and 58 wt.% Bi) were first evaluated metallographically and …

Effective acquisition of the related mechanical properties of lead-free solder alloys through
micro-indentation tests is of great significance in the research on electronic interconnection …

The commercial alloy 2024 was directionally solidified under different magnetic fields and its
microstructure and tensile mechanical properties were investigated. The application of …

In-35 wt% Sn alloy is a superconductive alloy and its superconductivity is highly dependent
on the properties of the β-In 3 Sn phase. However, detail solidification behaviour with …