Solder joints play a critical role in electronic devices by providing electrical, mechanical and
thermal interconnections. These miniature joints are also the weakest links in an electronic …

Abstract Large Ag 3 Sn plates in solder joints can affect the reliability of electronics,
however, the factors affecting their nucleation and morphology are not well understood …

The mechanical reliability of the future miniaturized interconnects is mainly governed by the
intermetallic compounds such as Cu 6 Sn 5. Alloyed Cu 6 Sn 5 with various elements …

In order to obtain a better understanding of the phase stabilities and mechanical behaviors
of Cu 3 Sn compounds, we performed first-principles calculations to predict the structural …

Solder joint reliability suffers great challenges due to high current density and miniature
solder bump diameter of electronic packages at cryogenic temperature. To tackle these …

We investigate the role of an Ag interlayer to suppress Kirkendall void formation in Ti/Ni
surface finishes on the die-attached joints during harsh thermal aging tests at 250° C. GaN …

To ensure optimal working conditions for the next-generation power modules, a
comprehensive understanding of the thermo-mechanical properties of the joint layer …

Abstract In this study, Ni-Cu/SAC composite solders with different Cu contents were used as
an interlayer to solder Al alloy joints at 250℃ for different time. The results showed that the …

Fatigue of die-attach solder joints is quite critical to reliability of IGBT modules. In the present
work, physics of failure of die-attach joints in IGBTs was discussed based on the evolution of …

Abstract βSn nucleation is a key step in the formation of microstructure in electronic solder
joints. Here, the heterogeneous nucleation of βSn is studied in undercooled tin droplets …