Energy-efficient 3D multi-band I/O interface for enhanced mobile memory communication
A Alzahmi - Automatika, 2025 - Taylor & Francis
This article develops an energy-efficient 3D multi-band I/O interface to meet the demand for
high computation and improve battery life for future mobile memory interfaces exploiting 3D …
high computation and improve battery life for future mobile memory interfaces exploiting 3D …
An optimal design methodology for yield-improved and low-power pipelined ADC
An energy-efficient, high-performance, and yield-improved analog to digital converter (ADC)
design using a multi-objective evolutionary algorithm is demonstrated. The proposed ADC …
design using a multi-objective evolutionary algorithm is demonstrated. The proposed ADC …
Power Supply Design and Power Management in Complex System Design: Co-Packaged Optics-FPGA 3D SIP Module
JK Bhandari, S Dharavath, PV Ramana… - 2024 IEEE 74th …, 2024 - ieeexplore.ieee.org
In this work a Co-Packaged Optics-FPGA-Memory-Power supply 3D module," LightSiP (TM)
System-in-Package" is presented. The Power Supply Design discussed here is for a multi …
System-in-Package" is presented. The Power Supply Design discussed here is for a multi …
Reliability-aware 3-D clock distribution network using memristor ratioed logic
A novel reliability-aware clock distribution network clock distribution network in a 3-DI/O
interface packaging integrating memristor ratioed logic (MRL) is presented. An evolutionary …
interface packaging integrating memristor ratioed logic (MRL) is presented. An evolutionary …
Energy efficient 5Gb/s/pin baseband transceiver for 3D memory interface
An energy-efficient 5Gb/s baseband (BB) transceiver for three-dimensional (3D) memory
interconnect is introduced. The proposed transceiver exploits low power and high-speed …
interconnect is introduced. The proposed transceiver exploits low power and high-speed …
A 3D flash ADC structure for high-speed communication applications
A 5-bit highly-accurate, low-power, and high-performance three-dimensional (3D) flash
analog to digital converter (ADC) is presented for communication system applications. This …
analog to digital converter (ADC) is presented for communication system applications. This …
Performance-Aware and Power-Efficient Three Dimensional (3D) Integrated Circuit (IC) Design Utilizing Evolutionary Algorithms
N Mirzaie - 2019 - scholar.smu.edu
Abstract High-performance, low-power, and high-accuracy circuit design with a compact
silicon area is necessary for a wide range of current applications. Three-dimensional …
silicon area is necessary for a wide range of current applications. Three-dimensional …
High-Performance and Energy Efficient Multi-Band I/O Interface for 3D Stacked Memory
A Alzahmi - 2018 - scholar.smu.edu
This dissertation describes the development of an energy efficient 3D multi-band I/O
interface to meet the demand for high computation and improve battery life for future mobile …
interface to meet the demand for high computation and improve battery life for future mobile …