[图书][B] Nanopackaging: Nanotechnologies and electronics packaging
JE Morris - 2018 - Springer
Level one electronics packaging is traditionally defined as the design and production of the
encapsulating structure that provides mechanical support, environmental protection …
encapsulating structure that provides mechanical support, environmental protection …
Enhanced thermal conductivity and mechanical property via improvement of hydrogen bonding between hexagonal boron nitride and aramid copolymer
H Jeong, J Lyu, H Choi, MW Kim, J Kim, H Yoo… - … Science and Technology, 2024 - Elsevier
This study focuses on enhancing thermal properties of aramid copolymer nanocomposites
by integrating hexagonal boron nitride (hBN). Pristine hBN (P-hBN) is first subjected to …
by integrating hexagonal boron nitride (hBN). Pristine hBN (P-hBN) is first subjected to …
The effects of graphene-based films as heat spreaders for thermal management in electronic packaging
S Huang, J Bao, H Ye, N Wang, G Yuan… - 2016 17th …, 2016 - ieeexplore.ieee.org
Graphene-based films (GBF) were fabricated using a chemical conversion process including
graphene oxide (GO) preparation by use of Hummer's method, graphene oxide reduction …
graphene oxide (GO) preparation by use of Hummer's method, graphene oxide reduction …
APCVD hexagonal boron nitride thin films for passive near-junction thermal management of electronics
The ability of graphene to serve as an ultrathin heat spreader has been previously
demonstrated with impressive results. However, graphene is electrically conductive, making …
demonstrated with impressive results. However, graphene is electrically conductive, making …
[图书][B] Thermoelectric-and hot-electron effects in graphene devices
G Skoblin - 2017 - search.proquest.com
A technology of encapsulation of graphene in Parylene was introducedas an alternative to
encapsulating graphene in hBN. Edge contacts to theencapsulated graphene in this case …
encapsulating graphene in hBN. Edge contacts to theencapsulated graphene in this case …