The wire bonding industry has made a major shift in wire materials from gold to copper,
primarily due to cost concerns. Copper wire-bonds are now present in many commercial off …

Wire bonding is key to high-quality IC assembly in semiconductor packaging. An electrical
test was conducted before wire bonding. During the electrical test, the needle probes …

Shear testing of wire bonds in microelectronics devices is important in bonding process
qualification, but the actual mechanism of shearing Cu bonds from Al pads is not thoroughly …

Epoxy mold compounds can exhibit changes in material properties with aging at high
temperature, that can significantly affect reliability of interconnects. This study focuses on …

The wire bonding process is one of the most critical processes in semiconductor packaging.
The electrical performance and reliability of IC chips must be evaluated by probe testing …

Copper has been widely adopted as a viable alternative to gold for wire bonding, due to its
lower cost, better electrical and thermal conductivity, lower tendency for wire sweep due to a …

Thermal stresses occur on wire Bonds due to mismatch of coefficient of thermal expansion
(CTE) between wire and mold compound in addition to the global deformation of the …

Copper (Cu) wire bond is used in a majority of microelectronic devices but has not been fully
accepted by all industries due to potential reliability issues. Good quality bond is believed to …