Nanocomposite lead-free solders are gaining prominence as replacements for conventional
lead-free solders such as Sn–Ag–Cu solder in the electronic packaging industry. They are …

The effects of strain rate on the shear fracture behavior of Sn3. 0Ag0. 5Cu/Cu solder joints
with thin and thick interfacial intermetallic compound layers were investigated. A single lap …

The formation mechanism and orientation of Cu 3 Sn grains in Cu–Sn intermetallic
compound (IMC) joints formed on polycrystalline and (100),(111) single crystal Cu …

The morphologies and orientations of Cu 6 Sn 5 intermetallic compounds in the Sn3. 0Ag0.
5Cu solder joints both on polycrystalline and single crystal Cu pads under different peak …

Abstract βSn nucleation is a key step in the formation of microstructure in electronic solder
joints. Here, the heterogeneous nucleation of βSn is studied in undercooled tin droplets …

Cu6Sn5 intermetallic compound (IMC), which occupies most even full of solder joints
bringing by the reduced size of interconnection and the multi-functional demand for devices …

The morphological evolution and grain orientations of intermetallic compounds (IMCs) were
investigated during the formation of full Cu 3 Sn joints at two soldering temperatures (310 …

In this study, the interfacial phase evolution during Cu/Sn/Cu soldering (260° C, 1 N) with a
micro interconnected height of 6 μm was analyzed. During soldering, the Cu 6 Sn 5 …

Cu 6 Sn 5 is the most prominent intermetallic developing eg in solder joints between a Cu-
based conductor material and a Sn-based solder. Mechanical reliability issues connected …

A new kind of intermetallic compounds (IMC) were found around copper pillar in micron
level bumps. To investigate the formation mechanism, three different sized Sn/Ni/Cu bumps …