Three-dimensional integration in microelectronics: Motivation, processing, and thermomechanical modeling
TS Cale, JQ Lu, RJ Gutmann - Chemical Engineering …, 2008 - Taylor & Francis
Three-dimensional integration (3D-I) of multiple layers of active devices into a single chip is
opening up opportunities for disruptive microelectronic, optoelectronic, and …
opening up opportunities for disruptive microelectronic, optoelectronic, and …
Numerical analysis of thermo-mechanical reliability of through silicon vias (TSVs) and solder interconnects in 3-dimensional integrated circuits
LJ Ladani - Microelectronic Engineering, 2010 - Elsevier
Three-dimensional integrated circuit (3D IC) is a promising technology in today's IC
packaging industry. Since the technology is in infancy stages, many aspects of this …
packaging industry. Since the technology is in infancy stages, many aspects of this …
Stress analysis of 3-dimensional IC package as function of structural design parameters
LJ Ladani - Microelectronic Engineering, 2010 - Elsevier
Solid Liquid Inter-Diffusion (SLID) is a technology that has recently been utilized to fabricate
3D ICs. Since application of this technology is in its infancy stages, manufacturability and …
3D ICs. Since application of this technology is in its infancy stages, manufacturability and …
A finite-element analysis of intragranular microcracks in metal interconnects due to surface diffusion induced by stress migration
D He, P Huang - Computational materials science, 2014 - Elsevier
Based on the classical theory of surface diffusion and evaporation–condensation, a finite-
element program is developed for simulating the shape instability of intragranular …
element program is developed for simulating the shape instability of intragranular …
Thermal analysis of four-layer 3D IC with TSVs based on face-to-back bonding
X Du, Z Tang - 2011 IEEE Electrical Design of Advanced …, 2011 - ieeexplore.ieee.org
Three dimensional integrated circuits (3D ICs) have attracted much interest in the recent
past, because of their capabilities for more efficient device integration and faster circuit …
past, because of their capabilities for more efficient device integration and faster circuit …
Design for reliability of stacked die package using TSV technology
S Thakur, S Nakanekar… - International …, 2011 - asmedigitalcollection.asme.org
A thermo-mechanical analysis is carried out on a stacked die package having through
silicon via technology to study the overall reliability of the package due to varying aspect …
silicon via technology to study the overall reliability of the package due to varying aspect …
[图书][B] Thermo-mechanical reliability of micro-interconnects in three-dimensional integrated circuits: Modeling and simulation
O Rodriguez - 2010 - search.proquest.com
Three-dimensional integrated circuits (3D ICs) have been designed with the purpose of
achieving higher communication speed by reducing the interconnect length between …
achieving higher communication speed by reducing the interconnect length between …
Thermo-mechanical reliability of through silicon vias (TSVS) and solder interconnects in 3-dimensional integrated circuits
LJ Ladani, O Rodriguez - International …, 2009 - asmedigitalcollection.asme.org
3-dimensional integrated circuit (3D IC) is a promising technology in today's IC packaging
industry. Since the technology is in infancy stages, many aspects of this technology are still …
industry. Since the technology is in infancy stages, many aspects of this technology are still …