Ultimate monolithic-3D integration with 2D materials: rationale, prospects, and challenges
As a possible pathway to continue Moore's law indefinitely into the future as well as
unprecedented beyond-Moore heterogeneous integration, we examine the prospects of …
unprecedented beyond-Moore heterogeneous integration, we examine the prospects of …
Thermal modeling, analysis, and management in VLSI circuits: Principles and methods
M Pedram, S Nazarian - Proceedings of the IEEE, 2006 - ieeexplore.ieee.org
The growing packing density and power consumption of very large scale integration (VLSI)
circuits have made thermal effects one of the most important concerns of VLSI designers …
circuits have made thermal effects one of the most important concerns of VLSI designers …
Modeling and analysis of nonuniform substrate temperature effects on global ULSI interconnects
Nonuniform thermal profiles on the substrate in high-performance ICs can significantly
impact the performance of global on-chip interconnects. This paper presents a detailed …
impact the performance of global on-chip interconnects. This paper presents a detailed …
Reducing clock skew variability via cross links
Increasingly significant variational effects present a great challenge for delivering desired
clock skew reliably. Non-tree clock network has been recognized as a promising approach …
clock skew reliably. Non-tree clock network has been recognized as a promising approach …
Thermally aware design modification
R Chandra, A Srinivasan, N Gopal - US Patent 7,823,102, 2010 - Google Patents
In a first variation, a thermally aware design automation Suite integrates system-level
thermal awareness into design of semiconductor chips, performing fine-grain thermal simula …
thermal awareness into design of semiconductor chips, performing fine-grain thermal simula …
Analysis and optimization of thermal issues in high-performance VLSI
This paper provides an overview of various thermal issues in high-performance VLSI with
especial attention to their implications for performance and reliability. More specifically, it …
especial attention to their implications for performance and reliability. More specifically, it …
Analysis of IR-drop scaling with implications for deep submicron P/G network designs
AH Ajami, K Banerjee, A Mehrotra… - … Symposium on Quality …, 2003 - ieeexplore.ieee.org
This paper presents a detailed analysis of the power-supply voltage (IR) drop scaling in
DSM technologies. For the first time, the effects of temperature, electromigration and …
DSM technologies. For the first time, the effects of temperature, electromigration and …
Method and apparatus for improved integrated circuit temperature evaluation and IC design
RC Chandra - US Patent 9,323,870, 2016 - Google Patents
A method and apparatus generates thermal partitions for metal interconnects of an
integrated circuit, based on interconnect self heat data and mutual heat data. Each of the …
integrated circuit, based on interconnect self heat data and mutual heat data. Each of the …
DELTA: Delta encoding for less traffic for apps
N Samteladze, K Christensen - 37th Annual IEEE Conference …, 2012 - ieeexplore.ieee.org
The number of applications (or apps) in the Android Market exceeded 450,000 in 2012 with
more than 11 billion total downloads. The necessity to fix bugs and add new features leads …
more than 11 billion total downloads. The necessity to fix bugs and add new features leads …