Ultrathin broadband germanium–graphene hybrid photodetector with high performance

F Yang, H Cong, K Yu, L Zhou, N Wang… - … Applied Materials & …, 2017 - ACS Publications
Germanium-based photodetector is a key component in silicon based photonics because of
its unique properties of response at telecommunication band and compatibility with CMOS …

Ultrahigh-Quality Ge-on-Glass with a 3.7% Uniaxial Tensile Strain

L Wang, G Xia - ACS omega, 2024 - ACS Publications
While there have been notable advancements in the quality of epitaxial Ge on Si, the crystal
quality of bulk Ge remains much superior, which provides an effective method to study the …

Dielectric engineered Schottky barrier MOSFET for biosensor applications: proposal and investigation

R Singh, S Kaim, R MedhaShree, A Kumar, S Kale - Silicon, 2022 - Springer
In this paper, for the first time, we have investigated a Dielectric Engineered Schottky Barrier
MOSFET (DE-SBMOS) for Biosensor applications. The DE SBMOS uses dielectric …

Performance analysis of feedback field-effect transistor-based biosensor

D Singh, GC Patil - IEEE Sensors Journal, 2020 - ieeexplore.ieee.org
To speed up the performance of the device with scaling down the physical size, steep
switching has become the major concern for reduction in subthreshold slope. In this paper …

Warpage reduction and thermal stress study of dicing process in wafer-to-wafer bonding fabrication

W Feng, H Shimamoto, T Kawagoe… - … on Electron Devices, 2022 - ieeexplore.ieee.org
We successfully study the warpage after wafer-to-wafer (W2W) bonding by the experiments
and the full wafer model simulation. Furthermore, the effect of the dicing process on the …

Impact of Channel Thickness on the NBTI Behaviors in the Ge-OI pMOSFETs With Al2O3/GeOx Gate Stacks

Y Sun, W Schwarzenbach, S Yuan… - IEEE Journal of the …, 2023 - ieeexplore.ieee.org
The impact of channel thickness on the negative-bias temperature instability (NBTI)
behaviors has been studied for the Germanium-on-Insulator (Ge-OI) pMOSFETs. It is found …

[HTML][HTML] Effects of hydrogen ion implantation dose on physical and electrical properties of Ge-on-insulator layers fabricated by the smart-cut process

CM Lim, Z Zhao, K Sumita, K Toprasertpong… - AIP advances, 2020 - pubs.aip.org
We experimentally evaluate the influence of a hydrogen ion implantation (I/I) dose on the
physical and electrical properties of Ge-on-insulator (GOI) films fabricated by the smart-cut …

Effect of TEOS layer on wafer warpage for wafer-to-wafer bonding

W Feng, H Shimamoto, K Kikuchi - Microelectronics Reliability, 2025 - Elsevier
The key enabling technology for 3D integration is Wafer-to-Wafer (WoW) bonding. One of
the main issues for the W2W bonding fabrication process is the wafer warpage. We explore …

Hole mobility in the ultra-thin-body junctionless germanium-on-insulator p-channel metal-oxide-semiconductor field-effect transistors

Y Li, R Zhang - Applied Physics Letters, 2019 - pubs.aip.org
Junctionless Germanium-on-insulator (GOI) p-channel metal-oxide-semiconductor field-
effect transistors (MOSFETs) have been realized with an ultra-thin-body (UTB) channel of …

Physical mechanisms of mobility enhancement in ultrathin body GeOI pMOSFETs fabricated by hetero-layer-lift-off technology

WH Chang, T Irisawa, H Ishii, N Uchida… - IEEE Transactions on …, 2019 - ieeexplore.ieee.org
Advanced channel formation technologies called HEtero-layer-lift-off utilizing SiGe
heteroepitaxy have been realized for fabricating ultrathin body (UTB) Ge-on-insulator (GeOI) …