A review of low-temperature solders in microelectronics packaging
The shift to lead-free solder alternatives led to the development of Sn–Ag–Cu (SAC) alloys
as the most used solders due to their superior mechanical properties and reliability …
as the most used solders due to their superior mechanical properties and reliability …
[HTML][HTML] Comprehensive analysis of Sn58Bi/Cu solder joints reinforced with Mg particles: Wettability, thermal, mechanics, and microstructural characterization
X Huang, L Zhang, C Chen, X Lu, X Wang - Journal of Materials Research …, 2023 - Elsevier
In this study, the Sn58Bi-xMg (x= 0, 0.2, 0.4, 0.6, 0.8, 1.0) composite solders were
synthesized to explore the impact of Mg particles. The study examined the wettability …
synthesized to explore the impact of Mg particles. The study examined the wettability …
[HTML][HTML] Microstructure evolution at the interface between Cu and eutectic Sn–Bi alloy with the addition of Ag or Ni
O Minho, Y Tanaka, E Kobayashi - Journal of Materials Research and …, 2023 - Elsevier
The study investigated the growth kinetics and rate-controlling processes of intermetallic
layers formed at the interface between Cu and eutectic Sn–Bi alloys with Ag or Ni addition at …
layers formed at the interface between Cu and eutectic Sn–Bi alloys with Ag or Ni addition at …
Effect of CuZnAl particles addition on microstructure of Cu/Sn58Bi/Cu TLP bonding solder joints
M Xiong, L Zhang, L Sun, P He, W Long - Vacuum, 2019 - Elsevier
In order to reduce the formation of voids in the Cu/Sn58Bi/Cu solder joints during transient
liquid phase (TLP) bonding, the effect of CuZnAl particles on microstructure of Cu/SnBi/Cu …
liquid phase (TLP) bonding, the effect of CuZnAl particles on microstructure of Cu/SnBi/Cu …
Relationship between spacing of eutectic colonies and tensile properties of transient directionally solidified Al-Ni eutectic alloy
Abstract Eutectic Al-Ni alloys are widely faced as materials to be considered for advanced
structural components. Nevertheless, still there is a lack of research on microstructural …
structural components. Nevertheless, still there is a lack of research on microstructural …
Deformation mechanism of various Sn-xBi alloys under tensile tests
S Cai, X Luo, J Peng, Z Yu, H Zhou, N Liu… - … Composites and Hybrid …, 2021 - Springer
In this study, the thermal properties, mechanical properties, and microstructure evolution of
Sn-x Bi (x= 0, 10, 17, 20, 30, 40, 50, and 58 wt.%, respectively) alloys were investigated via …
Sn-x Bi (x= 0, 10, 17, 20, 30, 40, 50, and 58 wt.%, respectively) alloys were investigated via …
Improvement of microstructure and tensile properties of Sn–Bi–Ag alloy by heterogeneous nucleation of β-Sn on Ag3Sn
T Yang, X Zhao, Z Xiong, W Tan, Y Wei, C Tan… - Materials Science and …, 2020 - Elsevier
Abstract Different weight fractions (0, 0.5, 1.0, 2.0, and 3.0 wt%) of sliver (Ag) were used to
dope Sn–Bi eutectic alloys in this study. The microstructure and tensile and thermal …
dope Sn–Bi eutectic alloys in this study. The microstructure and tensile and thermal …
Near-eutectic Zn-Mg alloys: Interrelations of solidification thermal parameters, microstructure length scale and tensile/corrosion properties
Zn-Mg alloys are considered to have potential application in bone implants, since both
metals are biocompatible and have biodegradable characteristics. Adding Mg to Zn can …
metals are biocompatible and have biodegradable characteristics. Adding Mg to Zn can …
Microstructure and mechanical properties of Sn–Bi solder joints reinforced with Zn@ Sn core–shell particles
F Wang, X Wang, K Xu, J Wang, W Zhang… - Journal of Materials …, 2022 - Springer
Abstract We proposed Zn@ Sn particles to improve the mechanical properties of the Sn–58
wt% Bi (Sn58Bi) solder. The effects of 3, 6, and 9 wt% Zn@ Sn particles on the …
wt% Bi (Sn58Bi) solder. The effects of 3, 6, and 9 wt% Zn@ Sn particles on the …
Microstructural evolution and failure mechanism dominated by Bi, Sb cooperative diffusion at p-type thermoelectric pillar Bi-Sb-Te/Sn interface
Bismuth telluride-based thermoelectric devices have attracted much attention in the field of
low-quality waste heat recovery below 200° C. However, the rapid diffusion at the interface …
low-quality waste heat recovery below 200° C. However, the rapid diffusion at the interface …