Low-temperature solderless Cu-Cu bonding is an important technology for advanced
packaging, such as fine-pitch 3-D packaging and heterogeneous integration. In this study …

With the rapid advancements in surface mount technology (SMT), microelectronic packaging
products are becoming smaller, denser, and defect-free. This has led to stricter requirements …

By interconnecting smaller chiplets through an interposer, 2.5 D integration offers a cost-
effective and high-yield solution to implement large-scale modular systems. Nevertheless …

Snsingle bondBi based solders have attracted widespread attention due to their promising
applications in heterogeneous integration and three-dimensional microelectronic …

Scanning Acoustic Microscopy (SAM) is a non-destructive evaluation technique that is
widely used in the semiconductor and microelectronics industries. Image quality and defect …

The feasibility of using selective thermal cobalt metal (Co) atomic layer deposition (ALD) as
high density Cu-Cu interconnect bonding is demonstrated at a low temperature (200° C) and …

Through silicon via (TSV) technology is considered as the most promising 3-D packaging
method due to its excellent electrical performance. However, the electromigration (EM) effect …

Cu-Cu bonding is one of the most promising fine-pitch interconnect technologies with solder
elimination for 2.5 D and 3D system integration. This bonding technology has been …

The feasibility of a 3D bonding technology for ultra-dense input/output (I/O) interconnects
using cobalt selective atomic layer deposition (Co ALD) is explored with a preliminary …

The conventional thermo-compression bonding method in either solder-based or solder-less
approaches for the 3D chip integration lead to reliability issues including warpage …