Composite technology, where a novel artificial material is fabricated by combining, for
example, ceramic and polymer materials in an ordered manner or just by mixing, was earlier …

Flexible microwave substrates have been fabricated using micron size powders of α-Al2O3
and MgO filled in polytetrafluoroethylene (PTFE) matrix through SMECH process …

The effects of polymorphic form and particle size of SiO2 fillers on the dielectric, mechanical
and thermal properties of SiO2–Polyetheretherketone (SiO2–PEEK) composites were …

This article discusses the preparation and characterization of CaTiO3 filled PTFE flexible
laminates for microwave substrate applications. Single phase CaTiO3 filler composition was …

Polytetrafluoroethylene (PTFE) composites filled with recycled borosilicate (rBRS) glass
were fabricated for printed circuit board (PCB) substrate application. The rBRS powder …

Dielectric substrates for microwave applications differ in many ways from the conventional
printed circuit boards (PCBs) used at low frequencies. Microwave packaging technology …

Abstract Phase pure cordierite (2MgO· 2Al 2 O 3· 5SiO 2) powder was prepared through
solid state ceramic route. Silane coated cordierite powder was filled in the PTFE matrix …

Abstract Atomic Force Microscopy (AFM) images contain information regarding the
variations in atomic and molecular forces from a few atomic layers beneath the surface of the …

Electrophoretic deposition (EPD) has been successfully used to deposit composite coatings
composed of polyetheretherketone (PEEK) and titanium dioxide (TiO2) nanoparticles on …

This paper deals with the application D-optimal mixture design (DMD) integrating response
surface methodology (RSM) to discuss variation of mechanical characteristics depending on …