As a powerful enabling technology, three-dimensional (3D) integration, which uses wafer
bonding to integrate multiple wafers in the vertical direction and uses through‑silicon-vias …

Through-silicon via (TSV) is a key packaging technology that facilitates the 2.5 D/3D
integration of microelectromechanical system (MEMS) devices. Among various MEMS …

Superconducting devices with high-density integration are required for applications, such as
high-performance detectors and quantum computing. Here, the direct bonding of Nb …

Conventional Cu through silicon via (TSV)(5× 50 μm) with Al metal lines on 300mm Si
substrate were fabricated and electrically tested at cryogenic temperatures down to 20mK in …

超导量子计算是目前最有可能实现实际应用的量子计算方案之一, 多层堆叠是实现超导量子比特
大规模扩展的最佳方案. 介绍了超导量子芯片中硅穿孔(TSV) 填充工艺的特点并汇总概括了当前 …

In this study, we present a method for filling molten solder into through-glass via (TGV)
substrates using a pulse width modulated (PWM) vacuum suction system. The TGV …

超导量子比特由于半导体工艺兼容性强, 可扩展潜力大, 易于操控, 读出与耦合,
是现阶段最有希望实现可扩展通用量子计算机的技术路线之一. 然而, 通用量子计算的实现需要 …

As one of the mainstream technique routes to implement universal quantum computing,
superconducting qubit has been highly anticipated in recent years. However, the current …

We describe a microfabrication process that, thanks to a specifically tailored sidewall profile,
enables for the first-time wafer-scale arrays of high-aspect ratio through-silicon vias (TSVs) …

Superconducting quantum is one of the leading candidates in the race to build a quantum
computer and multi-layer stacking may be the best solution for the superconducting qubits …