A review of direct drive proportional electrohydraulic spool valves: industrial state-of-the-art and research advancements

P Tamburrano, AR Plummer… - Journal of …, 2019 - asmedigitalcollection.asme.org
This paper reviews the state of the art of directly driven proportional directional hydraulic
spool valves, which are widely used hydraulic components in the industrial and …

Thermal management and characterization of high-power wide-bandgap semiconductor electronic and photonic devices in automotive applications

SK Oh, JS Lundh, S Shervin… - Journal of …, 2019 - asmedigitalcollection.asme.org
GaN-based high-power wide-bandgap semiconductor electronics and photonics have been
considered as promising candidates to replace conventional devices for automotive …

Device-level thermal management of gallium oxide field-effect transistors

B Chatterjee, K Zeng, CD Nordquist… - IEEE Transactions …, 2019 - ieeexplore.ieee.org
The ultrawide bandgap (UWBG)(~ 4.8 eV) and melt-grown substrate availability of β-Ga 2 O
3 give promise to the development of next-generation power electronic devices with …

High-resolution thermoreflectance imaging investigation of self-heating in AlGaN/GaN HEMTs on Si, SiC, and diamond substrates

A El Helou, P Komarov, MJ Tadjer… - … on Electron Devices, 2020 - ieeexplore.ieee.org
Gallium nitride (GaN) high electron-mobility transistors (HEMTs) offer considerable high-
power operation but suffer in reliability due to potentially damaging self-heating. In this …

Experimental characterization of the thermal time constants of GaN HEMTs via micro-Raman thermometry

KR Bagnall, OI Saadat, S Joglekar… - … on Electron Devices, 2017 - ieeexplore.ieee.org
Gallium nitride (GaN) high-electron mobility transistors (HEMTs) are a key technology for
realizing next generation high-power RF amplifiers and high-efficiency power converters …

Transient thermal characterization of AlGaN/GaN HEMTs under pulsed biasing

G Pavlidis, D Kendig, ER Heller… - IEEE Transactions on …, 2018 - ieeexplore.ieee.org
The development of steady-state thermal characterization techniques for AlGaN/GaN high-
electron mobility transistors (HEMTs) has been used to measure the device's peak …

Characterization of AlGaN/GaN HEMTs using gate resistance thermometry

G Pavlidis, S Pavlidis, ER Heller… - … on Electron Devices, 2016 - ieeexplore.ieee.org
In this paper, gate resistance thermometry (GRT) was used to determine the channel
temperature of AlGaN/GaN high electron-mobility transistors. Raman thermometry has been …

Theory of thermal time constants in GaN high-electron-mobility transistors

KR Bagnall, EN Wang - IEEE Transactions on Components …, 2017 - ieeexplore.ieee.org
Due to the high dissipated power densities present in GaN high-electron-mobility transistors
(HEMTs) in high-power radio frequency applications, thermal analysis and thermal …

A drain–source connection technique: Thermal resistance measurement method for GaN HEMTs using TSEP at high voltage

X Li, S Feng, C Liu, Y Zhang, K Bai… - … on Electron Devices, 2020 - ieeexplore.ieee.org
In the article, a new thermal resistance measurement method for GaN high electron mobility
transistor (HEMTs) is proposed based on temperature sensitive electrical parameter (TSEP) …

Device-level multidimensional thermal dynamics with implications for current and future wide bandgap electronics

JS Lundh, Y Song, B Chatterjee… - Journal of …, 2020 - asmedigitalcollection.asme.org
Researchers have been extensively studying wide-bandgap (WBG) semiconductor
materials such as gallium nitride (GaN) with an aim to accomplish an improvement in size …