Dies (110) with integrated circuits are attached to a wiring substrate (120), possibly an
interposer, and are protected by a protective substrate (410) attached to a wiring substrate …

A microelectronic unit can include a substrate having front and rear surfaces and active
semiconductor devices therein, the substrate having a plurality of openings arranged in a …

(57) ABSTRACT A microelectronic assembly can include a Substrate having first and
second Surfaces, at least two logic chips overlying the first surface, and a memory chip …

The present invention relates to packaging of microelec tronic devices and interposer
structures, especially conduc tive via structures and methods of forming Such via structures …

(57) ABSTRACT A microelectronic structure has active elements defining a storage array,
and address inputs for receipt of address infor mation specifying locations within the storage …

2010-11-08 Assigned to TESSERA RESEARCH LLC reassignment TESSERA RESEARCH
LLC ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS) …

(57) ABSTRACT A method of forming a semiconductor package comprises forming one or
more first vias in a first side of a substrate and attaching a first side of a first microelectronic …

A method of fabricating a microelectronic unit includes providing a semiconductor element
having a front Surface and a rear Surface remote from the front Surface, forming at least one …

Apparatuses relating generally to a microelectronic package having protection from
interference are disclosed. In an apparatus thereof, a substrate has an upper surface and a …

In a microelectronic device, a substrate has first upper and lower surfaces. An integrated
circuit die has second upper and lower surfaces. Interconnects couple the first upper surface …