Purpose The purpose of the present study was to review the thermo-mechanical challenges
of reflowed lead-free solder joints in surface mount components (SMCs). The topics of the …

This study aims to assess the effect of the solder joint array layouts, including full and
peripheral designs, on the mechanical response and reliability of electronic packages …

Tin-Lead (Sn-37wt% Pb) eutectic solder joints on a chip scale package (CSP) attached to a
printed circuit board have been tested under power cycling from 0 to 100° C each cycle …

The aim of this paper is to investigate temperature and thermal stress responses at various
joint arrangements during the cooling stage of the reflow process using an effective …

Empirical fatigue life models such as the Coffin–Manson rule and its variants are commonly
used at the present time to predict the reliability of microelectronic packages. While there …

空洞是球栅阵列(BGA: Ball Grid Array) 器件在装配过程中形成的主要缺陷之一,
本文以增强性BGA (EBGA: Enhanced BGA) 为研究对象, 采用统一型粘塑性Anand …

For many harsh environment, high reliability product applications such as automotive,
military and avionics, the solder joint fatigue behaviour of electronic packages subjected to …

This paper presents the results from the research and development of the construction and
technology of a 3 dimensional surface mounting. The main idea is to use surface mounting …

Flip Chip Ball Grid Array (FCBGA) has been a common package technology to achieve
higher Input/Output (IO) count. In moving toward higher IO count without increasing the …

This paper reviews sub 1.00 mm ball pitch solder joint reliability (SJR) challenges under
compressive loaded thermal cycling stressing. It focuses on different types of heat sinks and …