Transport performance in novel elastomer nanocomposites: Mechanism, design and control

B Guo, Z Tang, L Zhang - Progress in Polymer Science, 2016 - Elsevier
Functional elastomer nanocomposites have found numerous applications in diverse hi-tech
areas. Transport phenomena, such as electrical conductivity, thermal conductivity and …

A review on thermal management of light-emitting diodes: From package-level to system-level

Z Li, J Tan, J Li, X Ding, Y Tang - Applied Thermal Engineering, 2024 - Elsevier
The widespread use of light-emitting diodes (LEDs) in advanced displays, optical
communications, and medical UV applications has led to a rapid increase in heat flux …

[图书][B] Organic light emitting devices: synthesis, properties and applications

K Müllen, U Scherf - 2006 - books.google.com
This high-class book reflects a decade of intense research, culminating in excellent
successes over the last few years. The contributions from both academia as well as the …

Thermal management of LEDs: package to system

M Arik, CA Becker, SE Weaver… - … conference on solid …, 2004 - spiedigitallibrary.org
Light emitting diodes, LEDs, historically have been used for indicators and produced low
amounts of heat. The introduction of high brightness LEDs with white light and …

Carbon nanotube thermal interface material for high-brightness light-emitting-diode cooling

K Zhang, Y Chai, MMF Yuen, DGW Xiao… - …, 2008 - iopscience.iop.org
Aligned carbon nanotube (CNT) arrays were fabricated from a multilayer catalyst
configuration by microwave plasma-enhanced chemical vapor deposition (PECVD). The …

Microstructure and electronic properties of InGaN alloys

FA Ponce, S Srinivasan, A Bell, L Geng… - … status solidi (b), 2003 - Wiley Online Library
The InxGa1− xN system has electronic band gaps extending from under 1eV to 3.4 eV, and
as such they are used as the active layer in commercially available visible‐light emitting …

Thermal analysis of high power LED package with heat pipe heat sink

X Lu, TC Hua, Y Wang - Microelectronics Journal, 2011 - Elsevier
The goal of this study is to improve the thermal characteristics of high power LED (light-
emitting diode) package using a flat heat pipe (FHP). The heat-release characteristics of …

Development and thermal performance of a vapor chamber with multi-artery reentrant microchannels for high-power LED

L Chen, D Deng, Q Huang, X Xu, Y Xie - Applied Thermal Engineering, 2020 - Elsevier
This study developed a vapor chamber (VC) with radial multi-artery reentrant microchannels
for thermal management of high-power light emitting diodes (LEDs). It featured Ω-shaped …

Scalable maximum clique computation using mapreduce

J Xiang, C Guo, A Aboulnaga - 2013 IEEE 29th International …, 2013 - ieeexplore.ieee.org
We present a scalable and fault-tolerant solution for the maximum clique problem based on
the MapReduce framework. The key contribution that enables us to effectively use …

RETRACTED: Experimental study on the thermal management of high-power LED headlight cooling device integrated with thermoelectric cooler package

J Wang, XJ Zhao, YX Cai, C Zhang, WW Bao - 2015 - Elsevier
One of the conditions of submission of a paper for publication is that authors declare
explicitly that the paper is not under consideration for publication elsewhere. As such this …