Real-time predictive control of photoresist film thickness uniformity
LL Lee, CD Schaper, WK Ho - IEEE Transactions on …, 2002 - ieeexplore.ieee.org
With the trends toward larger wafer size and the linewidth going below 100 nm, one of the
challenges is to control the resist thickness and uniformity to a tight tolerance in order to …
challenges is to control the resist thickness and uniformity to a tight tolerance in order to …
Estimation of wafer warpage profile during thermal processing in microlithography
Wafer warpage is common in microelectronics processing. Warped wafers can affect device
performance, reliability, and linewidth control in various processing steps. Early detection …
performance, reliability, and linewidth control in various processing steps. Early detection …
Minimum time control of conductive heating systems for microelectronics processing
A minimum time control scheme is designed to improve repeatability by minimizing the
loading effects induced by the common processing condition of placement of a …
loading effects induced by the common processing condition of placement of a …
Resist film uniformity in the microlithography process
With the trends toward smaller feature size, one of the challenge is to control the resist
thickness and uniformity to a tight tolerance in order to minimize thin film interference effects …
thickness and uniformity to a tight tolerance in order to minimize thin film interference effects …
Development of high-power VCSEL emitter of size 30mm x 30mm, scalable in two dimensions and applicable to Si wafer annealing
Y Noh, S Park, BK Kim, WJ Park, T Kim… - International Journal of …, 2022 - Elsevier
Two-dimensionally scalable vertical cavity surface emitting laser (VCSEL) emitter of size 30
mm× 30 mm was designed and fabricated for practical applications in the rapid heating …
mm× 30 mm was designed and fabricated for practical applications in the rapid heating …
In situ fault detection of wafer warpage in microlithography
Wafer warpage is common in microelectronics processing. Warped wafers can affect device
performance, reliability and linewidth control in various processing steps. We proposed in …
performance, reliability and linewidth control in various processing steps. We proposed in …
On control of resist film uniformity in the microlithography process
A novel approach to improve photoresist thickness uniformity after the conventional spin-
coating and softbake process is proposed in this paper. Using an array of thickness sensors …
coating and softbake process is proposed in this paper. Using an array of thickness sensors …
Constraint feedforward control for thermal processing of quartz photomasks in microelectronics manufacturing
A feedforward control scheme is designed to improve performance of conductive heating
systems used for lithography in microelectronics processing. It minimizes the loading effects …
systems used for lithography in microelectronics processing. It minimizes the loading effects …
A quality prognostics scheme for semiconductor and TFT-LCD manufacturing processes
YC Su, FT Cheng, GW Huang… - … Annual Conference of …, 2004 - ieeexplore.ieee.org
A quality prognostics scheme for predicting the product quality during the semiconductor or
TFT-LCD manufacturing processes is proposed in this work. This scheme considers the …
TFT-LCD manufacturing processes is proposed in this work. This scheme considers the …
Thermal modelling and design of dynamically-controlled heater plates for high temperature processing of 300 mm wafers
The temperature uniformity of heater plates (HPs) should be sustained due to critical
dimension uniformity and robust operation in high temperature processing of 300 mm …
dimension uniformity and robust operation in high temperature processing of 300 mm …