This review compares the mechanical and thermal-electrical properties of sintered copper
(Cu) with sintered silver (Ag) as bonding materials in the microelectronics joint applications …

Sintered silver joint is a porous silver that bonds a semiconductor die to the substrate as part
of the packaging process. Sintered Ag is one of the few possible bonding methods to fulfill …

Sintered Ag joint is a potential Pb-free die attach materials for power electronics because of
its high operating temperature, high electrical and thermal conductivity as well as its thermo …

Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated,
comprehensive discussion of encapsulants in electronic applications, with a primary …

Low-temperature Ag sintering provides a lead-free die attachment method that is compatible
with high-temperature (300° C) power electronics applications. The reliability of sintered Ag …

Wide bandgap (WBG) power devices with voltage ratings exceeding 10 kV have the
potential to revolutionize medium-and high-voltage systems due to their high-speed …

In this work, we applied a Ag flake formed paste for sinter-joining on bare Si, SiC, and GaN
surfaces. The sintered joints possess a high shear strength of over 40 MPa under a …

The high-temperature reliability of nano-Ag pastes on bare Cu substrates is of great
significance in power electronics. Although Cu metallization in sintered joints is susceptible …

Silver (Ag) sinter-joining is an ideal connection technique for wide bandgap (WBG) power
electronics packaging due to its excellent high-temperature stability and excellent thermal …

Silicon carbide (SiC) power modules with Ag sinter-bonding die attach were designed on
the basis of thermal stress analysis for reliable high-temperature operations. Both the finite …