An Ultra‐Thin, Ultra‐High Capacitance Density Tantalum Capacitor for 3D Packaging

J Zhao, Y Xu, W Hou, Y Li, X Ding - Advanced Materials …, 2023 - Wiley Online Library
Although embedded capacitors have been applied and researched for many years, their
large‐scale application still faces challenges such as low capacitance density, high …

System scaling with nanostructured power and RF components

PM Raj, H Sharma, S Sitaraman, D Mishra… - Proceedings of the …, 2017 - ieeexplore.ieee.org
The emergence of smartphones and other smart systems is driving new trends in electronics
scaling that goes beyond transistors or active devices, to include all the system components …

钽电解电容器用钽阳极制备技术的研究进展.

许志林, 杜显锋, 杨晓丽, 梁仲帅… - Electronic Components …, 2023 - search.ebscohost.com
为了适应近年来电子产品小型化和轻量化的发展趋势, 钽电解电容器正朝着大容量,
薄型化的方向发展, 制备高比容, 薄型化钽阳极是实现这一目标的有效途径之一 …

Future of embedding and fan-out technologies

R Tummala, V Sundaram, PM Raj… - 2017 Pan Pacific …, 2017 - ieeexplore.ieee.org
Embedding is the most important strategic technology that is applicable for all digital, RF and
power applications. When combined with fan-out at chip-and board-levels, it enables higher …

3-D packaging and integration of high-density tantalum capacitors on silicon

RG Spurney, H Sharma, PM Raj… - IEEE Transactions …, 2019 - ieeexplore.ieee.org
High-density, point-of-load (PoL) power conversion and power delivery are required to
continue scaling electronic systems with increased functionality, more bandwidth, and …

Oxide composition studies of electrochemically grown tantalum oxide on sintered tantalum using XPS depth-profiling and co-relation with leakage properties

P Chakraborti, H Sharma, MR Pulugurtha… - Journal of Materials …, 2017 - Springer
Chemical structure and leakage properties of electrochemically grown tantalum oxide films
on high-surface area tantalum were studied. Tantalum oxide films with different thicknesses …