A microprocessor assembly adapted for fluid cooling can include a semiconductor die
mounted on a substrate. The semiconductor die can include an integrated circuit with a two …

A system for cooling a mobile phone and method for using the system are described. The
system includes an active piezoelectric cooling system, a controller and an interface. The …

Techniques for integrating two-phase cooling into a micro processor chip package lid are
provided. In one aspect, a vapor chamber lid device includes: an evaporator plate; a …

A heat sink module for cooling a heat providing surface can include an inlet chamber and an
outlet chamber formed within the heat sink module. The outlet chamber can have an open …

US10184699B2 - Fluid distribution unit for two-phase cooling system - Google Patents
US10184699B2 - Fluid distribution unit for two-phase cooling system - Google Patents Fluid …

US8739856B2 - Evaporation-enhanced thermal management devices, systems, and
methods of heat management - Google Patents US8739856B2 - Evaporation-enhanced …

A cooling system and method for using the cooling system are described. The cooling
system includes a plurality of individual piezoelectric cooling elements spatially arranged in …

A method of cooling two or more heat-providing surfaces using a cooling apparatus having
two or more fluidly connected heat sink modules in a series configuration can include …

A method of absorbing heat from two or more devices can employ a two-phase cooling
apparatus that pumps low-pressure coolant through two or more fluidly-connected and …

A flexible two-phase cooling apparatus for cooling microprocessors in servers can include a
primary cooling loop, a first bypass, and a second bypass. The primary cooling loop can …