High scale-factor stability frequency-modulated MEMS gyroscope: 3-axis sensor and integrated electronics design
P Minotti, S Dellea, G Mussi, A Bonfanti… - IEEE Transactions …, 2017 - ieeexplore.ieee.org
This paper reports the developments toward an integrated, tri-axial, frequency-modulated,
consumergrade, and microelectromechanical system (MEMS) gyroscope. A custom low …
consumergrade, and microelectromechanical system (MEMS) gyroscope. A custom low …
Mechanics of copper wire bond failure due to thermal fatigue
S Manoharan, NMJ Li, C Patel, S Hunter… - 2018 IEEE 20th …, 2018 - ieeexplore.ieee.org
Thermal stresses occur on wire Bonds due to mismatch of coefficient of thermal expansion
(CTE) between wire and mold compound in addition to the global deformation of the …
(CTE) between wire and mold compound in addition to the global deformation of the …
Influence of initial shear strength on time-to-failure of copper (Cu) wire bonds in thermal aging condition
S Manoharan, C Patel, S Hunter… - Additional Papers …, 2018 - meridian.allenpress.com
Copper (Cu) wire bond is used in a majority of microelectronic devices but has not been fully
accepted by all industries due to potential reliability issues. Good quality bond is believed to …
accepted by all industries due to potential reliability issues. Good quality bond is believed to …
[PDF][PDF] Simulation of MEMS vibratory gyroscope through Simulink
Microelectromechanical systems (MEMS) vibratory gyroscopes are increasingly used in
applications ranging from consumer electronics to aerospace and are now one of the most …
applications ranging from consumer electronics to aerospace and are now one of the most …