Electronics packaging evolution involves system, technology, and material considerations.
In this paper, we present a novel three-dimensional (3-D) integration approach for system …

Recently, the market for wireless local area network (WLAN) products is booming rapidly
with the roll out of IEEE 802.11 b products into the home, public, and office environments …

Future wireless communications systems require better performance, lower cost, and
compact RF front-end footprint. The RF front-end module development and its level of …

This paper presents a novel 3D integration approach for system-on-package (SOP) based
solutions for wireless communication applications. This concept has been applied for the 3D …

In this paper, a system-on-package (SOP) technology using a thin-film substrate with a flip-
chip interconnection has been developed for compact and high-performance millimeter …

Higher level of integration has been seen to be the trend of package for wireless
communication products. Integration of passive components (eg RCL and filters) plays a …

A miniaturized microstrip stubs‐loaded square open‐loop bandpass filter (BPF) with
asymmetrical feeder lines is proposed. Using this filter structure, the improved out‐of‐band …

A compact composite low-pass filter, designed by the image parameter method and
semilumped component approach, will be described and results for cutoff frequency ranging …

A bidirectional, coplanar waveguide (CPW) fed dumbbell-shaped slot antenna with partially
reflecting surface (PRS) with parasitic patches for gain, bandwidth, and radiation pattern …

A novel configuration of quad‐band bowtie antenna suitable for wireless application is
proposed based on accurate equivalent circuit model. The simple configuration and low …