Silicon-Carbide (SiC) devices with superior performance over traditional silicon power
devices have become the prime candidates for future high-performance power electronics …

There has been a significant rise in the number of research papers on silver nanoparticle
based solutions for harsh environment die attach. However, sintering nanoparticles is a …

A review is provided, which first considers low-temperature diffusion bonding with silver
nanomaterials as filler materials via thermal sintering for microelectronic applications, and …

This work firstly evaluated the microscale mechanical properties of sintered Ag, consisting of
various Ag particles of a flake shape and spherical shape from nano to micro size …

With increased need for high power density, high efficiency and high temperature
capabilities in aerospace and automotive applications, integrated motor drives (IMD) offers a …

Soldering has been the main die attach technology for several decades. Recently, in order
to meet the high temperature electronic requirements (high temperature-operating SiC and …

We have developed a new method for preparing a paste containing a high concentration of
Ag nanoparticles for pressureless bonding. A nanoscale layer of polyvinylpyrrolidone coated …

There is an increasing interest in developing a low temperature interconnection process
using nanoparticles. Some studies focus on bonding using Ag nanoparticles (Ag NPs) …

Low-temperature Ag sintering provides a lead-free die attachment method that is compatible
with high-temperature (300° C) power electronics applications. The reliability of sintered Ag …

This paper presents the concept, fabrication, and evaluation for quality and reliability of
nickel-tin transient liquid phase (Ni-Sn TLP) bonding that provides high reliability for high …