Interfacial thermal resistance (ITR) is the main obstacle for heat flows from one material to
another. Understanding ITR becomes essential for the removal of redundant heat from fast …

Interfacial thermal resistance is the primary impediment to heat flow in materials and devices
as characteristic lengths become comparable to the mean‐free paths of the energy carriers …

The coupled interactions among the fundamental carriers of charge, heat, and
electromagnetic fields at interfaces and boundaries give rise to energetic processes that …

Interfaces often dictate heat flow in micro-and nanostructured systems,,. However, despite
the growing importance of thermal management in micro-and nanoscale devices,,, a unified …

The thermal boundary conductance (TBC) of materials pairs in atomically intimate contact is
reviewed as a practical guide for materials scientists. First, analytical and computational …

Heat transfer can differ distinctly at the nanoscale from that at the macroscale. Recent
advancement in computational and experimental techniques has enabled a large number of …

Composite materials and especially polymer composites are widely used in daily life and
different industries due to their vastly different properties and design flexibility. It is known …

The efficiency in modern technologies and green energy solutions has boiled down to a
thermal engineering problem on the nanoscale. Due to the magnitudes of the thermal mean …

Graphene-based devices have garnered tremendous attention due to the unique physical
properties arising from this purely two-dimensional carbon sheet leading to tremendous …

Cu/Ti bilayers were magnetron sputtered onto a diamond substrate to simulate interfaces in
diamond particles reinforced Cu matrix (Cu/diamond) composites. The Cu/Ti/diamond …